Bonnassieux, Yvan, Brabec, Christoph J, Cao, Yong, Carmichael, Tricia Breen, Chabinyc, Michael L, Cheng, Kwang-Ting, Cho, Gyoujin, Chung, Anjung, Cobb, Corie L, Distler, Andreas, Egelhaaf, Hans-Joachim, Grau, Gerd, Guo, Xiaojun, Haghiashtiani, Ghazaleh, Huang, Tsung-Ching, Hussain, Muhammad M, Iniguez, Benjamin, Lee, Taik-Min, Li, Ling, Ma, Yuguang, Ma, Dongge, McAlpine, Michael C, Ng, Tse Nga, Österbacka, Ronald, Patel, Shrayesh N, Peng, Junbiao, Peng, Huisheng, Rivnay, Jonathan, Shao, Leilai, Steingart, Daniel, Street, Robert A, Subramanian, Vivek, Torsi, Luisa, and Wu, Yunyun. The 2021 flexible and printed electronics roadmap. Retrieved from https://par.nsf.gov/biblio/10289355. Flexible and Printed Electronics 6.2 Web. doi:10.1088/2058-8585/abf986.

Bonnassieux, Yvan, Brabec, Christoph J, Cao, Yong, Carmichael, Tricia Breen, Chabinyc, Michael L, Cheng, Kwang-Ting, Cho, Gyoujin, Chung, Anjung, Cobb, Corie L, Distler, Andreas, Egelhaaf, Hans-Joachim, Grau, Gerd, Guo, Xiaojun, Haghiashtiani, Ghazaleh, Huang, Tsung-Ching, Hussain, Muhammad M, Iniguez, Benjamin, Lee, Taik-Min, Li, Ling, Ma, Yuguang, Ma, Dongge, McAlpine, Michael C, Ng, Tse Nga, Österbacka, Ronald, Patel, Shrayesh N, Peng, Junbiao, Peng, Huisheng, Rivnay, Jonathan, Shao, Leilai, Steingart, Daniel, Street, Robert A, Subramanian, Vivek, Torsi, Luisa, & Wu, Yunyun. The 2021 flexible and printed electronics roadmap. Flexible and Printed Electronics, 6 (2). Retrieved from https://par.nsf.gov/biblio/10289355. https://doi.org/10.1088/2058-8585/abf986

Bonnassieux, Yvan, Brabec, Christoph J, Cao, Yong, Carmichael, Tricia Breen, Chabinyc, Michael L, Cheng, Kwang-Ting, Cho, Gyoujin, Chung, Anjung, Cobb, Corie L, Distler, Andreas, Egelhaaf, Hans-Joachim, Grau, Gerd, Guo, Xiaojun, Haghiashtiani, Ghazaleh, Huang, Tsung-Ching, Hussain, Muhammad M, Iniguez, Benjamin, Lee, Taik-Min, Li, Ling, Ma, Yuguang, Ma, Dongge, McAlpine, Michael C, Ng, Tse Nga, Österbacka, Ronald, Patel, Shrayesh N, Peng, Junbiao, Peng, Huisheng, Rivnay, Jonathan, Shao, Leilai, Steingart, Daniel, Street, Robert A, Subramanian, Vivek, Torsi, Luisa, and Wu, Yunyun. "The 2021 flexible and printed electronics roadmap". Flexible and Printed Electronics 6 (2). Country unknown/Code not available. https://doi.org/10.1088/2058-8585/abf986. https://par.nsf.gov/biblio/10289355.

@article{osti_10289355,
place = {Country unknown/Code not available}, title = {The 2021 flexible and printed electronics roadmap}, url = {https://par.nsf.gov/biblio/10289355}, DOI = {10.1088/2058-8585/abf986}, abstractNote = {}, journal = {Flexible and Printed Electronics}, volume = {6}, number = {2}, author = {Bonnassieux, Yvan and Brabec, Christoph J and Cao, Yong and Carmichael, Tricia Breen and Chabinyc, Michael L and Cheng, Kwang-Ting and Cho, Gyoujin and Chung, Anjung and Cobb, Corie L and Distler, Andreas and Egelhaaf, Hans-Joachim and Grau, Gerd and Guo, Xiaojun and Haghiashtiani, Ghazaleh and Huang, Tsung-Ching and Hussain, Muhammad M and Iniguez, Benjamin and Lee, Taik-Min and Li, Ling and Ma, Yuguang and Ma, Dongge and McAlpine, Michael C and Ng, Tse Nga and Österbacka, Ronald and Patel, Shrayesh N and Peng, Junbiao and Peng, Huisheng and Rivnay, Jonathan and Shao, Leilai and Steingart, Daniel and Street, Robert A and Subramanian, Vivek and Torsi, Luisa and Wu, Yunyun}, editor = {null} }