This content will become publicly available on December 1, 2022
W -Band MMIC Chip Assembly Using Laser-Enhanced Direct Print Additive Manufacturing
- Award ID(s):
- 1726875
- Publication Date:
- NSF-PAR ID:
- 10303762
- Journal Name:
- IEEE Transactions on Microwave Theory and Techniques
- Volume:
- 69
- Issue:
- 12
- ISSN:
- 0018-9480
- Sponsoring Org:
- National Science Foundation