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This content will become publicly available on December 1, 2022

Title: W -Band MMIC Chip Assembly Using Laser-Enhanced Direct Print Additive Manufacturing
Authors:
; ; ;
Award ID(s):
1726875
Publication Date:
NSF-PAR ID:
10303762
Journal Name:
IEEE Transactions on Microwave Theory and Techniques
Volume:
69
Issue:
12
ISSN:
0018-9480
Sponsoring Org:
National Science Foundation
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