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Abstract The thermal conductivity of many materials depends on temperature due to several factors, including variation of heat capacity with temperature, changes in vibrational dynamics with temperature, and change in volume with temperature. For proteins some, but not all, of these influences on the variation of thermal conductivity with temperature have been investigated in the past. In this study, we examine the influence of change in volume, and corresponding changes in vibrational dynamics, on the temperature dependence of the thermal conductivity. Using a measured value for the coefficient of thermal expansion and recently computed values for the Grüneisen parameter of proteins we find that the thermal conductivity increases with increasing temperature due to change in volume with temperature. We compare the impact of thermal expansion on the variation of the thermal conductivity with temperature found in this study with contributions of heat capacity and anharmonic coupling examined previously. Using values of thermal transport coefficients computed for proteins we also model heating of water in a protein solution following photoexcitation.
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Orientation-dependent transport properties of Cu3Sn
Cu3Sn, a well-known intermetallic compound with a high melting temperature and thermal stability, has found numerous applications in microelectronics, 3D printing, and catalysis. However, the relationship between the material's thermal conductivity anisotropy and its complex anti-phase boundary superstructure is not well understood. Here, frequency domain thermoreflectance was used to map the thermal conductivity variation across the surface of arc-melted polycrystalline Cu3Sn. Complementary electron backscatter diffraction and transmission electron microscopy revealed the thermal conductivity in the principal a, b, and c orientations to be 57.6, 58.9, and 67.2 W/m-K, respectively. Density functional theory calculations for several Cu3Sn superstructures helped examine thermodynamic stability factors and evaluate the direction-resolved electron transport properties in the relaxation time approximation. The analysis of computed temperature- and composition-dependent free energies suggests metastability of the known long-period Cu3Sn superstructures while the transport calculations indicate a small directional variation in the thermal conductivity. The ∼15% anisotropy measured and computed in this study is well below previously reported experimental values for samples grown by liquid-phase electroepitaxy.
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- PAR ID:
- 10319875
- Date Published:
- Journal Name:
- Acta materialia
- Volume:
- 227
- ISSN:
- 1873-2453
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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- Free Publicly Accessible Full Text
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Accepted Manuscript1.0
- Journal Article:
- https://doi.org/10.1016/j.actamat.2022.117671
