Zheng, Ting, Jo, Paul K., Rajan, Sreejith Kochupurackal, and Bakir, Muhannad S. Electrical Characterization and Benchmarking of Polylithic Integration Using Fused-Silica Stitch-Chips With Compressible Microinterconnects for RF/mm-Wave Applications. Retrieved from https://par.nsf.gov/biblio/10329615. IEEE Transactions on Components, Packaging and Manufacturing Technology 11.11 Web. doi:10.1109/TCPMT.2021.3113886.

Zheng, Ting, Jo, Paul K., Rajan, Sreejith Kochupurackal, & Bakir, Muhannad S. Electrical Characterization and Benchmarking of Polylithic Integration Using Fused-Silica Stitch-Chips With Compressible Microinterconnects for RF/mm-Wave Applications. IEEE Transactions on Components, Packaging and Manufacturing Technology, 11 (11). Retrieved from https://par.nsf.gov/biblio/10329615. https://doi.org/10.1109/TCPMT.2021.3113886

Zheng, Ting, Jo, Paul K., Rajan, Sreejith Kochupurackal, and Bakir, Muhannad S. "Electrical Characterization and Benchmarking of Polylithic Integration Using Fused-Silica Stitch-Chips With Compressible Microinterconnects for RF/mm-Wave Applications". IEEE Transactions on Components, Packaging and Manufacturing Technology 11 (11). Country unknown/Code not available. https://doi.org/10.1109/TCPMT.2021.3113886. https://par.nsf.gov/biblio/10329615.

@article{osti_10329615,
place = {Country unknown/Code not available}, title = {Electrical Characterization and Benchmarking of Polylithic Integration Using Fused-Silica Stitch-Chips With Compressible Microinterconnects for RF/mm-Wave Applications}, url = {https://par.nsf.gov/biblio/10329615}, DOI = {10.1109/TCPMT.2021.3113886}, abstractNote = {}, journal = {IEEE Transactions on Components, Packaging and Manufacturing Technology}, volume = {11}, number = {11}, author = {Zheng, Ting and Jo, Paul K. and Rajan, Sreejith Kochupurackal and Bakir, Muhannad S.}, }