skip to main content
US FlagAn official website of the United States government
dot gov icon
Official websites use .gov
A .gov website belongs to an official government organization in the United States.
https lock icon
Secure .gov websites use HTTPS
A lock ( lock ) or https:// means you've safely connected to the .gov website. Share sensitive information only on official, secure websites.

Explore Research Products in the PAR
It may take a few hours for recently added research products to appear in PAR search results.


Title: Hydrothermal Performance of Liquid Cooled Battery Thermal Management System with Multiple Inlets
Heat transfer and pumping power of water-cooled thermal management systems (TMSs) for lithium-ion batteries (LIBs) in electric vehicles (EVs) are investigated through a three-dimensional computational approach. TMSs are cylindrical shells that cover LIBs. Water flows through the shell and removes heat from LIBs. The focus of this study is to provide practical insights on the effects of number of inlets on the thermal performance and pumping power of TMSs. Two TMSs with one and four inlets at the top of the TMS’s case are considered. Both TMSs include one outlet, which is located at the bottom of the case. The thermal performance of individual TMSs is evaluated by the maximum temperature of the battery cell and the temperature difference across the cell. The thermal performances are described based on the pumping power. Simulations are performed at different flow rates within a laminar regime. Results indicate that both TMSs provide safe operational temperatures for LIBs. However, compared to the one-inlet design, the four-inlet TMS archives the same thermal performance but at a lower pumping power. The lower pumping power is due to lower pressure drop in the four-inlet TMS resulting from flowing water with lower flow rate at individual inlets, and through a shorter path from individual inlets to the outlet, compared with the one-inlet TMS. Minimizing pumping power without any penalty in the thermal performance is significantly beneficial, especially when the TMS is used for a pack of LIBs in EVs.  more » « less
Award ID(s):
1914751
PAR ID:
10332058
Author(s) / Creator(s):
;
Date Published:
Journal Name:
Proceedings of the 9th International Conference on Fluid Flow, Heat and Mass Transfer (FFHMT’22)
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
More Like this
  1. ; ; ; ; ; ; ; ; ; ; et al (, American Society of Mechanical Engineers)
    Abstract Data centers are witnessing an unprecedented increase in processing and data storage, resulting in an exponential increase in the servers’ power density and heat generation. Data center operators are looking for green energy efficient cooling technologies with low power consumption and high thermal performance. Typical air-cooled data centers must maintain safe operating temperatures to accommodate cooling for high power consuming server components such as CPUs and GPUs. Thus, making air-cooling inefficient with regards to heat transfer and energy consumption for applications such as high-performance computing, AI, cryptocurrency, and cloud computing, thereby forcing the data centers to switch to liquid cooling. Additionally, air-cooling has a higher OPEX to account for higher server fan power. Liquid Immersion Cooling (LIC) is an affordable and sustainable cooling technology that addresses many of the challenges that come with air cooling technology. LIC is becoming a viable and reliable cooling technology for many high-power demanding applications, leading to reduced maintenance costs, lower water utilization, and lower power consumption. In terms of environmental effect, single-phase immersion cooling outperforms two-phase immersion cooling. There are two types of single-phase immersion cooling methods namely, forced and natural convection. Here, forced convection has a higher overall heat transfer coefficient which makes it advantageous for cooling high-powered electronic devices. Obviously, with natural convection, it is possible to simplify cooling components including elimination of pump. There is, however, some advantages to forced convection and especially low velocity flow where the pumping power is relatively negligible. This study provides a comparison between a baseline forced convection single phase immersion cooled server run for three different inlet temperatures and four different natural convection configurations that utilize different server powers and cold plates. Since the buoyancy effect of the hot fluid is leveraged to generate a natural flow in natural convection, cold plates are designed to remove heat from the server. For performance comparison, a natural convection model with cold plates is designed where water is the flowing fluid in the cold plate. A high-density server is modeled on the Ansys Icepak, with a total server heat load of 3.76 kW. The server is made up of two CPUs and eight GPUs with each chip having its own thermal design power (TDPs). For both heat transfer conditions, the fluid used in the investigation is EC-110, and it is operated at input temperatures of 30°C, 40°C, and 50°C. The coolant flow rate in forced convection is 5 GPM, whereas the flow rate in natural convection cold plates is varied. CFD simulations are used to reduce chip case temperatures through the utilization of both forced and natural convection. Pressure drop and pumping power of operation are also evaluated on the server for the given intake temperature range, and the best-operating parameters are established. The numerical study shows that forced convection systems can maintain much lower component temperatures in comparison to natural convection systems even when the natural convection systems are modeled with enhanced cooling characteristics. 
    more » « less
  2. ; ; ; ; ; (, Journal of Electronic Packaging)
    Abstract The increased power consumption and continued miniaturization of high-powered electronic components have presented many challenges to their thermal management. To improve the efficiency and reliability of these devices, the high amount of heat that they generate must be properly removed. In this paper, a three-dimensional numerical model has been developed and experimentally validated for several manifold heat sink designs. The goal was to enhance the heat sink's thermal performance while reducing the required pumping power by lowering the pressure drop across the heat sink. The considered designs were benchmarked to a commercially available heat sink in terms of their thermal and hydraulic performances. The proposed manifolds were designed to distribute fluid through alternating inlet and outlet branched internal channels. It was found that using the manifold design with 3 channels reduced the thermal resistance from 0.061 to 0.054 °C/W with a pressure drop reduction of 0.77 kPa from the commercial cold plate. A geometric parametric study was performed to investigate the effect of the manifold's internal channel width on the thermohydraulic performance of the proposed designs. It was found that the thermal resistance decreased as the manifold's channel width decreased, up until a certain width value, below which the thermal resistance started to increase while maintaining low-pressure drop values. Where the thermal resistance significantly decreased in the 7 channels design by 16.4% and maintained a lower pressure drop value below 0.6 kPa. 
    more » « less
  3. ; ; ; ; ; (, Applied Thermal Engineering)
    In recent years, electronic packaging has evolved significantly to meet demands for higher performance, lower costs, and smaller designs. This shift has led to heterogeneous packaging, which integrates chips of varying stack heights and results in non-uniform heat flux and temperature distributions. These conditions pose substantial thermal management challenges, as they can create large temperature gradients, which increase thermal stress and potentially compromise chip reliability. This study explores single-phase liquid cooling for multi-chip modules (MCMs) through a comprehensive experimental and machine learning approach. It investigates the impact of chip spacing, height, fluid flow rate, fluid inlet location, and heat flux uniformity on chip temperature and the thermohydraulic performance of a commercial cold plate. Results show that increasing coolant flow from 1 LPM to 2 LPM decreased thermal resistance by 26 %, with heat losses remaining below 5 %. The left inlet configuration improved temperature uniformity compared to the right, though both yielded comparable thermal performance. Adjusting heater spacing impacted temperature distribution based on inlet position, and lowering one heater by 1 mm raised its temperatures by 15 ◦C due to increased thermal resistance from thermal interface material. A transient test demonstrated the cold plate’s quick response to power surges, in which there is only a 1 ◦C spike above steady state. Complementing these findings, an Artificial Neural Network (ANN) model was developed with optimized architecture specifically for the unique challenges of this study. The ANN model was rigorously validated using an independent dataset, achieving highly accurate temperature predictions (R2 = 0.99) within 2.5 % of experimental 
    more » « less
  4. ; ; ; (, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems)
    The constant increase in data center computational and processing requirements has led to increases in the IT equipment power demand and cooling challenges of highdensity (HD) data centers. As a solution to this, the hybrid and liquid systems are widely used as part of HD data centers thermal management solutions. This study presents an experimental based investigation and analysis of the transient thermal performance of a stand-alone server cabinet. The total heat load of the cabinet is controllable remotely and a rear door heat exchanger is attached with controllable water flow rate. The cooling performances of two different failure scenarios are investigated. One is in the water chiller and another is in the water pump for the Rear Door Heat eXchanger (RDHX). In addition, the study reports the impact of each scenario on the IT equipment thermal response and on the cabinet outlet temperature using a mobile temperature and velocity mesh (MTVM) experimental tool. Furthermore, this study also addresses and characterizes the heat exchanger cooling performance during both scenarios. 
    more » « less
  5. ; ; ; ; ; ; ; (, American Society of Mechanical Engineers)
    Abstract Data centers are critical to the functioning of modern society as they host digital infrastructure. However, data centers can consume significant amounts of energy, and a substantial amount of this energy goes to cooling systems. Efficient thermal management of information technology equipment is therefore essential and allows the user to obtain peak performance from a system and enables higher equipment reliability. Thermal management of data center electronics is becoming more challenging due to rising power densities at the chip level. Cooling technologies like single-phase immersion cooling allow overcoming many such challenges owing to their higher thermal mass, lower fluid pumping powers, and potential component reliability enhancements. It is known that immersion cooling deployments require extremely low coolant flow rates, and, in many cases, natural convection can also be used to sufficiently dissipate the heat from the hot server components. It, therefore, becomes difficult to ascertain whether the rate of heat transfer is being dominated by forced or natural convection. This may lead to ambiguity in choosing an optimal heat sink solution and a suitable system mechanical design due to unknown flow regimes, further leading to sub-optimal system performance. Mixed convection can be used to enhance heat transfer in immersion cooling systems. The present investigation quantifies the contribution of mixed convection using numerical methods in an immersion-cooled server. An open compute server with dual CPU sockets is modeled on Ansys Icepak with varying power loads of 115W, 160W and 200W. The chosen dielectric fluid for this single-phase immersion-cooled setup is EC-100. Steady-state Computational Fluid Dynamics (CFD) simulations are conducted for forced, natural, and mixed convection heat transfer in a thermally shadowed server configuration at varying inlet flow rates. A baseline heat sink and an optimized heat sink with an increased fin thickness and reduced fin count are utilized for performance comparison. The effect of varying Reynolds number and Richardson number on the heat transfer rate from the heat sink is discussed to assess the flow regime, stability of the flow around the submerged components which depends on the geometry, orientation, fluid properties, flow rate and direction of the flow. The dimensionless numbers’ influence on heat transfer rate from a conventional air-cooled heat sink in immersion versus an immersion-optimized heat sink is also compared. The impact of server orientation on heat transfer behavior for the immersion optimized heat sink is also studied on heat transfer behavior for the immersion optimized heat sink. 
    more » « less
  • Citation Formats
  • MLA
  • APA
  • Chicago
  • BibTeX
  • Save / Share this Record
  • Send to Email