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Title: Exploring an Efficient Approach for Architecture-Level Thermal Simulation of Multi-core CPUs
Award ID(s):
2003307
PAR ID:
10336196
Author(s) / Creator(s):
; ; ;
Publisher / Repository:
IEEE
Date Published:
ISSN:
2158-1525
ISBN:
978-1-6654-8485-5
Format(s):
Medium: X
Location:
Austin, TX, USA
Sponsoring Org:
National Science Foundation
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