Exploring an Efficient Approach for Architecture-Level Thermal Simulation of Multi-core CPUs
- Award ID(s):
- 2003307
- PAR ID:
- 10336196
- Publisher / Repository:
- IEEE
- Date Published:
- ISSN:
- 2158-1525
- ISBN:
- 978-1-6654-8485-5
- Format(s):
- Medium: X
- Location:
- Austin, TX, USA
- Sponsoring Org:
- National Science Foundation
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Accepted Manuscript1.0
- Conference Paper:
- https://doi.org/10.1109/ISCAS48785.2022.9937274
