A water-cooled multi-die heat sink with parallel rectangular micro-channels was designed to satisfy the operational requirements of a multi-die processor. A shape optimization strategy based on the RSM (response surface method) was used to minimize pressure drop and die maximum case temperatures. The effects of the thermal interface materials and heat spreader between the dies and heat sink were captured by the numerical
simulation. The optimization was performed for constant values of coolant flow rate and inlet temperature, as well as the power, location, and surface area of the dies. The influence of channel hydraulic diameter, Reynolds number, thermal entrance length, and total heat transfer surface area on the hydraulic and thermal performance of the heat sink was determined using CFD (computational fluid dynamics) simulations at RSM design points. A sensitivity analysis was performed to evaluate the effect of the design parameters on the response parameters. The optimum designs were achieved by minimizing a weighted objective function defined based on response parameters using JAYA algorithm. The results of weighted sum method were compared with Pareto based three objective optimization with a NSGA-II (non-dominated sorting GENETIC algorithm). Finally, a parametric study was performed to see the effect of the design parameters on the response parameters.
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Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink
Abstract The increased power consumption and continued miniaturization of high-powered electronic components have presented many challenges to their thermal management. To improve the efficiency and reliability of these devices, the high amount of heat that they generate must be properly removed. In this paper, a three-dimensional numerical model has been developed and experimentally validated for several manifold heat sink designs. The goal was to enhance the heat sink's thermal performance while reducing the required pumping power by lowering the pressure drop across the heat sink. The considered designs were benchmarked to a commercially available heat sink in terms of their thermal and hydraulic performances. The proposed manifolds were designed to distribute fluid through alternating inlet and outlet branched internal channels. It was found that using the manifold design with 3 channels reduced the thermal resistance from 0.061 to 0.054 °C/W with a pressure drop reduction of 0.77 kPa from the commercial cold plate. A geometric parametric study was performed to investigate the effect of the manifold's internal channel width on the thermohydraulic performance of the proposed designs. It was found that the thermal resistance decreased as the manifold's channel width decreased, up until a certain width value, below which the thermal resistance started to increase while maintaining low-pressure drop values. Where the thermal resistance significantly decreased in the 7 channels design by 16.4% and maintained a lower pressure drop value below 0.6 kPa.
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- NSF-PAR ID:
- 10338898
- Date Published:
- Journal Name:
- Journal of Electronic Packaging
- Volume:
- 144
- Issue:
- 3
- ISSN:
- 1043-7398
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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- Free Publicly Accessible Full Text
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Accepted Manuscript1.0
- Journal Article:
- https://doi.org/10.1115/1.4054461
