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4. Cybersecurity, Image-Based Control, and Process Design and Instrumentation Selection

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   Messina, Dominic; Leonard, Akkarakaran Francis; Hightower, Ryan; Nieman, Kip; ONeill, Renee; Beacham, Paloma; Tyrrell, Katie; Adnan, Muhammad; Durand, Helen (July 2024, LAPSE)

   Within an Industry 4.0 framework, a variety of new considerations are of increasing importance, such as securing processes against cyberattacks on the control systems or utilizing advances in image processing for image-based control. These new technologies impact relationships between process design and control. In this work, we discuss some of these potential relationships, beginning with a discussion of side channel attacks and what they suggest about ways of evaluating plant design and instrumentation selection, along with controller and security schemes, particularly as more data is collected and there is a move toward an industrial Internet of Things. Next, we highlight how the 3D computer graphics software tool set Blender can be utilized to analyze a variety of considerations related to ensuring safety of plant operation and facilitating the design of assemblies with image-based sensing. 

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5. Profile monitoring based quality control method for fused deposition modeling process

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   He, Ketai; Zhang, Qian; Hong, Yili (May 2018, Journal of Intelligent Manufacturing)

   In order to monitor the quality of parts in printing, the methodology to monitor the geometric quality of the printed parts in fused deposition modeling process is researched. A non-contact measurement method based on machine vision technology is adopted to obtain the precise complete geometric information. An image acquisition system is established to capture the image of each layer of the part in building and image processing technology is used to obtain the geometric profile information.With the above information, statistical process control method is applied to monitor the geometric quality of the parts during the printing process. Firstly, a border signature method is applied to transform complex geometry into a simple distance-angle function to get the profile deviation data. Secondly, monitoring of the profile deviation data based on profile monitoring method is studied and applied to achieve the goal of layer-to-layer monitoring. In the research, quantile-quantile plot method is used to transform the profile deviation point cloud data monitoring problem into a linear profile relationship monitoring problem andEWMAcontrol charts are established to monitor the parameters of the linear relationship to detect shifts occurred in the Fused Deposition Modeling process. Finally, laboratory experiments are conducted to demonstrate the effectiveness of the proposed approach. 

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