Pivotal to functional van der Waals stacked flexible electronic/excitonic/spintronic/thermoelectric chips is the synergy amongst constituent layers. However; the current techniques viz. sequential chemical vapor deposition, micromechanical/wet‐chemical transfer are mostly limited due to diffused interfaces, and metallic remnants/bubbles at the interface. Inter‐layer‐coupled 2+
- Award ID(s):
- 1921958
- NSF-PAR ID:
- 10362756
- Date Published:
- Journal Name:
- Nanoscale
- Volume:
- 14
- Issue:
- 16
- ISSN:
- 2040-3364
- Page Range / eLocation ID:
- 6133 to 6143
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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- Free Publicly Accessible Full Text
-
Accepted Manuscript1.0
- Journal Article:
- https://doi.org/10.1039/d1nr07772d
