To address demands for increased data transmission rates, electrically small antennas (ESAs) that simultaneously offer large frequency bandwidths and small physical sizes are of growing interest. 3D layouts are particularly important in this context and among various 3D ESAs, systems that adopt hemispherical shapes are very promising, because they can occupy the entire Chu‐sphere and offer outstanding electrical performance. Researchers have developed a few different approaches to fabricate high‐quality hemispherical ESAs, but most have static layouts and fixed operating frequencies. Here, a mechanically guided 3D assembly approach is introduced for the design and fabrication of deformable hemispherical ESAs that can offer tunable, dynamic properties to adapt to changes in environmental conditions. The strategy exploits controlled compressive buckling of strategically patterned 2D precursor structures, as a low‐cost and high‐yield scheme that can exploit conventional, planar processing technologies and commercially available platforms. Combined numerical simulations and experimental measurements show outstanding performance characteristics in terms of the quality factor and radiation efficiency. Application of external tensile strains to elastomeric substrates for these systems allows them to be reshaped and reversibly tuned through a wide range of center frequencies. Mechanical testing under different loading conditions demonstrates the ability of these ESAs to accommodate large deformations.
3D, hierarchical micro/nanostructures formed with advanced functional materials are of growing interest due to their broad potential utility in electronics, robotics, battery technology, and biomedical engineering. Among various strategies in 3D micro/nanofabrication, a set of methods based on compressive buckling offers wide‐ranging material compatibility, fabrication scalability, and precise process control. Previously reports on this type of approach rely on a single, planar prestretched elastomeric platform to transform thin‐film precursors with 2D layouts into 3D architectures. The simple planar configuration of bonding sites between these precursors and their assembly substrates prevents the realization of certain types of complex 3D geometries. In this paper, a set of hierarchical assembly concepts is reported that leverage multiple layers of prestretched elastomeric substrates to induce not only compressive buckling of 2D precursors bonded to them but also of themselves, thereby creating 3D mesostructures mounted at multiple levels of 3D frameworks with complex, elaborate configurations. Control over strains used in these processes provides reversible access to multiple different 3D layouts in a given structure. Examples to demonstrate these ideas through both experimental and computational results span vertically aligned helices to closed 3D cages, selected for their relevance to 3D conformal bio‐interfaces and multifunctional microsystems.
more » « less- NSF-PAR ID:
- 10364180
- Publisher / Repository:
- Wiley Blackwell (John Wiley & Sons)
- Date Published:
- Journal Name:
- Advanced Materials
- Volume:
- 34
- Issue:
- 12
- ISSN:
- 0935-9648
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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