Miller, James M. L., Bousse, Nicholas E., Heinz, David B., Kim, Hyo Jin K., Kwon, Hyun-Keun, Vukasin, Gabrielle D., and Kenny, Thomas W. Thermomechanical-Noise-Limited Capacitive Transduction of Encapsulated MEM Resonators. Journal of Microelectromechanical Systems 28.6 Web. doi:10.1109/JMEMS.2019.2936843.

Miller, James M. L., Bousse, Nicholas E., Heinz, David B., Kim, Hyo Jin K., Kwon, Hyun-Keun, Vukasin, Gabrielle D., & Kenny, Thomas W. Thermomechanical-Noise-Limited Capacitive Transduction of Encapsulated MEM Resonators. Journal of Microelectromechanical Systems, 28 (6). https://doi.org/10.1109/JMEMS.2019.2936843

Miller, James M. L., Bousse, Nicholas E., Heinz, David B., Kim, Hyo Jin K., Kwon, Hyun-Keun, Vukasin, Gabrielle D., and Kenny, Thomas W. "Thermomechanical-Noise-Limited Capacitive Transduction of Encapsulated MEM Resonators". Journal of Microelectromechanical Systems 28 (6). Country unknown/Code not available: Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/JMEMS.2019.2936843. https://par.nsf.gov/biblio/10364794.

@article{osti_10364794,
place = {Country unknown/Code not available}, title = {Thermomechanical-Noise-Limited Capacitive Transduction of Encapsulated MEM Resonators}, url = {https://par.nsf.gov/biblio/10364794}, DOI = {10.1109/JMEMS.2019.2936843}, abstractNote = {Not Available}, journal = {Journal of Microelectromechanical Systems}, volume = {28}, number = {6}, publisher = {Institute of Electrical and Electronics Engineers}, author = {Miller, James M. L. and Bousse, Nicholas E. and Heinz, David B. and Kim, Hyo Jin K. and Kwon, Hyun-Keun and Vukasin, Gabrielle D. and Kenny, Thomas W.}, }