Engineering thermal transport within Si thin films: The impact of nanoslot alignment and ion implantation
- Award ID(s):
- 1651840
- NSF-PAR ID:
- 10399615
- Date Published:
- Journal Name:
- iScience
- Volume:
- 25
- Issue:
- 11
- ISSN:
- 2589-0042
- Page Range / eLocation ID:
- 105386
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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