This content will become publicly available on November 1, 2023
Engineering thermal transport within Si thin films: The impact of nanoslot alignment and ion implantation
- Award ID(s):
- 1651840
- Publication Date:
- NSF-PAR ID:
- 10399615
- Journal Name:
- iScience
- Volume:
- 25
- Issue:
- 11
- Page Range or eLocation-ID:
- 105386
- ISSN:
- 2589-0042
- Sponsoring Org:
- National Science Foundation
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