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Title: Engineering thermal transport within Si thin films: The impact of nanoslot alignment and ion implantation
Award ID(s):
1651840
NSF-PAR ID:
10399615
Author(s) / Creator(s):
; ; ;
Date Published:
Journal Name:
iScience
Volume:
25
Issue:
11
ISSN:
2589-0042
Page Range / eLocation ID:
105386
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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