Abstract High‐performance electrical conductors at higher temperatures are increasingly needed in aerospace, electric vehicles, and military applications. This study develops an innovative multilayered graphene–metal composite conductor, significantly surpassing the maximum temperature limit of conventional copper (≈90 °C for commercial wires). This approach involves integrating fine copper (Cu) wire with functional shells to exploit the high electrical conductivity and chemical inertness of silver (Ag) and graphene (G), as well as excellent anti‐oxidation of nickel (Ni). Three different composite conductors, namely, NiGCu, NiAgCu, and NiAgGCu, are synthesized, characterized, and compared to quantify their overall performance and investigate the functionality of each shell. This work highlights the importance of the G layer. For example, NiAgGCu has 29.3% lower resistivity than NiAgCu, 34% lower resistivity than NiGCu, and 18.7% higher current density limit than NiAgCu after exposure to 550–850 °C. Both molecular dynamics (MD) and finite elements (FE) simulations are performed to reveal the detailed mechanisms of unprecedented thermal stability. These theoretical studies suggest that the embedded continuous graphene layer, even with its unavoidable defects, is attributed to significant performance enhancements up to 850 °C. The results present possible strategies to address current technical bottlenecks for high‐performance electrical conductors in harsh environments.
more »
« less
High-Toughness Aluminum-N-Doped Polysilicon Wiring for Flexible Electronics
One of the essential requirements of any flexible substrate electronic system is the availability of reliable, high density, fine pitch interconnects between components. In this work, we demonstrate a high-toughness two-layer (aluminum, N-doped polysilicon) composite wiring scheme. The top aluminum layer carries most of the current while the polysilicon underlayer electrically bridges any cracks present on the top aluminum induced by flexing thus maintaining electrical conductivity even at very high stresses. When composite and Al control wires on a flexible tape were subject to 4000 cycles of bending, we observed that Al control wires fracture at a 2.5 mm radius of curvature but the composite wires maintain electrical conduction with an increased resistance.
more »
« less
- Award ID(s):
- 1932602
- PAR ID:
- 10402732
- Date Published:
- Journal Name:
- 2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)
- Page Range / eLocation ID:
- 1 to 4
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
More Like this
-
-
Conductive polymers, owing to their tunable mechanical and electrochemical properties, are viable candidates to replace metallic components for the development of biosensors and bioelectronics. However, conducting fibers/wires fabricated from these intrinsically conductive and mechanically flexible polymers are typically produced without protective coatings for physiological environments. Providing sheathed conductive fibers/wires can open numerous opportunities for fully organic biodevices. In this work, we report on a facile method to fabricate core-sheath poly(3,4-ethylenedioxythiophene):poly(styrenesulfonate) PEDOT:PSS-silk fibroin conductive wires. The conductive wires are formed through a wet-spinning process, and then coated with an optically transparent, photocrosslinkable silk fibroin sheath for insulation and protection in a facile and scalable process. The sheathed fibers were evaluated for their mechanical and electrical characteristics and overall stability. These wires can serve as flexible connectors to an organic electrode biosensor. The entire, fully organic, biodegradable, and free-standing flexible biosensor demonstrated a high sensitivity and rapid response for the detection of ascorbic acid as a model analyte. The entire system can be proteolytically biodegraded in a few weeks. Such organic systems can therefore provide promising solutions to address challenges in transient devices and environmental sustainability.more » « less
-
Most protective biological tissues are structurally comprised of a stiff and thin outer layer on top of a soft underlying substrate. Examples include mammalian skin, fish scales, crustacean shells, and nut and seed shells. While these composite skin-like tissues are ubiquitous in nature, their mechanics of failure and what potential mechanical advantages their composite structures offer remains unclear. In this work, changes in the puncture mechanics of composite hyperelastic elastomers with differing non-dimensional layer thicknesses are explored. Puncture behavior of these membranes is measured for dull and sharp conical indenters. Membranes with a stiff outer layer of only 1% of the overall composite thickness exhibit a puncture energy comparable to membranes with a stiff outer layer approximately 20 times thicker. This puncture energy, scaled by its flexural capacity, achieves a local maximum when the top layer is approximately 1% of the total membrane, similar to the structure of numerous mammalian species. The mode of failure for these regimes is also investigated. In contrast with puncture directly beneath sharp tips caused by high stress concentrations, a new type of ‘coring’ type fracture emerges at large indentation depths, resulting from accumulated tensile strain energy along the sides of the divot as the membrane is deformed with a blunt indenter. These results could enhance the durability and robustness of stretchable materials used for products such as surgical gloves, packaging, and flexible electronics.more » « less
-
The microscopic mechanisms underpinning the spontaneous surface passivation of metals from ubiquitous water have remained largely elusive. Here, using in situ environmental electron microscopy to atomically monitor the reaction dynamics between aluminum surfaces and water vapor, we provide direct experimental evidence that the surface passivation results in a bilayer oxide film consisting of a crystalline-like Al(OH)3top layer and an inner layer of amorphous Al2O3. The Al(OH)3layer maintains a constant thickness of ~5.0 Å, while the inner Al2O3layer grows at the Al2O3/Al interface to a limiting thickness. On the basis of experimental data and atomistic modeling, we show the tunability of the dissociation pathways of H2O molecules with the Al, Al2O3, and Al(OH)3surface terminations. The fundamental insights may have practical significance for the design of materials and reactions for two seemingly disparate but fundamentally related disciplines of surface passivation and catalytic H2production from water.more » « less
-
Abstract New deposition techniques for amorphous oxide semiconductors compatible with silicon back end of line manufacturing are needed for 3D monolithic integration of thin‐film electronics. Here, three atomic layer deposition (ALD) processes are compared for the fabrication of amorphous zinc tin oxide (ZTO) channels in bottom‐gate, top‐contact n‐channel transistors. As‐deposited ZTO films, made by ALD at 150–200 °C, exhibit semiconducting, enhancement‐mode behavior with electron mobility as high as 13 cm2V−1s−1, due to a low density of oxygen‐related defects. ZTO deposited at 200 °C using a hybrid thermal‐plasma ALD process with an optimal tin composition of 21%, post‐annealed at 400 °C, shows excellent performance with a record high mobility of 22.1 cm2V–1s–1and a subthreshold slope of 0.29 V dec–1. Increasing the deposition temperature and performing post‐deposition anneals at 300–500 °C lead to an increased density of the X‐ray amorphous ZTO film, improving its electrical properties. By optimizing the ZTO active layer thickness and using a high‐kgate insulator (ALD Al2O3), the transistor switching voltage is lowered, enabling electrical compatibility with silicon integrated circuits. This work opens the possibility of monolithic integration of ALD ZTO‐based thin‐film electronics with silicon integrated circuits or onto large‐area flexible substrates.more » « less
An official website of the United States government

