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Title: Analysis of stress in sputter-deposited films using a kinetic model for Cu, Ni, Co, Cr, Mo, W
Award ID(s):
2006422 1602491
PAR ID:
10405492
Author(s) / Creator(s):
; ; ; ;
Date Published:
Journal Name:
Applied Surface Science
Volume:
613
Issue:
C
ISSN:
0169-4332
Page Range / eLocation ID:
156000
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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