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1. Phase Selection and Structure of Low-Defect-Density γ-Al 2 O 3 Created by Epitaxial Crystallization of Amorphous Al 2 O 3

   https://doi.org/10.1021/acsami.0c17606  

   Liu, Rui ; Elleuch, Omar ; Wan, Zhongyi ; Zuo, Peng ; Janicki, Tesia D. ; Alfieri, Adam D. ; Babcock, Susan E. ; Savage, Donald E. ; Schmidt, J. R. ; Evans, Paul G. ; et al ( December 2020 , ACS Applied Materials & Interfaces)

   null (Ed.)

   A multistep phase sequence following the crystallization of amorphous Al2O3 via solid-phase epitaxy (SPE) points to methods to create low-defect-density thin films of the metastable cubic γ-Al2O3 polymorph. An amorphous Al2O3 thin film on a (0001) α-Al2O3 sapphire substrate initially transforms upon heating to form epitaxial γ-Al2O3, followed by a transformation to monoclinic θ-Al2O3, and eventually to α-Al2O3. Epitaxial γ-Al2O3 layers with low mosaic widths in X-ray rocking curves can be formed via SPE by crystallizing the γ-Al2O3 phase from amorphous Al2O3 and avoiding the microstructural inhomogeneity arising from the spatially inhomogeneous transformation to θ-Al2O3. A complementary molecular dynamics (MD) simulation indicates that the amorphous layer and γ-Al2O3 have similar Al coordination geometry, suggesting that γ-Al2O3 forms in part because it involves the minimum rearrangement of the initially amorphous configuration. The lattice parameters of γ-Al2O3 are consistent with a structure in which the majority of the Al vacancies in the spinel structure occupy sites with tetrahedral coordination, consistent with the MD results. The formation of Al vacancies at tetrahedral spinel sites in epitaxial γ-Al2O3 can minimize the epitaxial elastic deformation of γ-Al2O3 during crystallization. 

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2. Demonstration of AlGaN Tunnel Junction p-Down UV Light Emitting Diodes

   Dominic Merwin Xavier, Agnes Maneesha ; Ghosh, Arnob: Rahman ; Allerman, Andrew ; Arafin, Shamsul ; Rajan, Siddharth ( June 2023 , EMC)

   Ultra-violet light emitting diodes (UV-LEDs) and lasers based on the III-Nitride material system are very promising since they enable compact, safe, and efficient solid-state sources of UV light for a range of applications. The primary challenges for UV LEDs are related to the poor conductivity of p-AlGaN layers and the low light extraction efficiency of LED structures. Tunnel junction-based UV LEDs provide a distinct and unique pathway to eliminate several challenges associated with UV LEDs1-4. In this work, we present for the first time, a reversed-polarization (p-down) AlGaN based UV-LED utilizing bottom tunnel junction (BTJ) design. We show that compositional grading enables us to achieve the lowest reported voltage drop of 1.1 V at 20 A/cm2 among transparent AlGaN based tunnel junctions at this Al-composition. Compared to conventional LED design, a p-down structure offers lower voltage drop because the depletion barrier for both holes and electrons is lower due to polarization fields aligning with the depletion field. Furthermore, the bottom tunnel junction also allows us to use polarization grading to realize better p- and n-type doping to improve tunneling transport. The epitaxial structure of the UV-LED was grown by plasma-assisted molecular beam epitaxy (PAMBE) on metal-organic chemical vapor deposition (MOCVD)-grown n-type Al0.3Ga0.7N templates. The transparent TJ was grown using graded n++-Al0.3Ga0.7N→ n++-Al0.4Ga0.6N (Si=3×1020 cm-3) and graded p++-Al0.4Ga0.6N →p++-Al0.3Ga0.7N (Mg=1×1020 cm-3) to take advantage of induced 3D polarization charges. The high number of charges at the tunnel junction region leads to lower depletion width and efficient hole injection to the p-type layer. The UV LED active region consists of three 2.5 nm Al0.2Ga0.8N quantum wells and 7 nm Al0.3Ga0.6N quantum barriers followed by 12 nm of p- Al0.46Ga0.64N electron blocking layer (EBL). The active region was grown on top of the tunnel junction. A similar LED with p-up configuration was also grown to compare the electrical performance. The surface morphology examined by atomic force microscopy (AFM) shows smooth growth features with a surface roughness of 1.9 nm. The dendritic features on the surface are characteristic of high Si doping on the surface. The composition of each layer was extracted from the scan by high resolution x-ray diffraction (HR-XRD). The electrical characteristics of a device show a voltage drop of 4.9 V at 20 A/cm2, which corresponds to a tunnel junction voltage drop of ~ 1.1 V. This is the best lowest voltage for transparent 30% AlGaN tunnel junctions to-date and is comparable with the lowest voltage drop reported previously on non-transparent (InGaN-based) tunnel junctions at similar Al mole fraction AlGaN. On-wafer electroluminescence measurements on patterned light-emitting diodes showed single peak emission wavelength of 325 nm at 100 A/cm2 which corresponds to Al0.2Ga0.8N, confirming that efficient hole injection was achieved within the structure. The device exhibits a wavelength shift from 330 nm to 325 nm with increasing current densities from 10A/cm2 to 100A/cm2. In summary, we have demonstrated a fully transparent bottom AlGaN homojunction tunnel junction that enables p-down reversed polarization ultraviolet light emitting diodes, and has very low voltage drop at the tunnel junction. This work could enable new flexibility in the design of future III-Nitride ultraviolet LEDs and lasers. 

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3. Comparative Spectroscopic Study of Aluminum Nitride Grown by MOCVD in H2 and N2 Reaction Environment

   https://doi.org/10.3390/coatings12070924  

   Hasan, Samiul ; Jewel, Mohi Uddin ; Karakalos, Stavros G. ; Gaevski, Mikhail ; Ahmad, Iftikhar ( July 2022 , Coatings)

   We report a comparative spectroscopic study on the thin films of epitaxial aluminum nitride (AlN) on basal plane sapphire (Al2O3) substrates grown in hydrogen (H2) and nitrogen (N2) gas reaction environments. AlN films of similar thicknesses (~3.0 µm) were grown by metal-organic chemical vapor deposition (MOCVD) for comparison. The impact of the gas environment on the AlN epilayers was characterized using high-resolution X-ray diffraction (HR-XRD), X-ray photoelectron spectroscopy (XPS), Raman scattering (RS), secondary ion mass spectroscopy (SIMS), cathodoluminescence (CL), atomic force microscopy (AFM), and scanning electron microscopy (SEM). The study showed that AlN layers grown in a N2 environment have 50% less stress (~0.5 GPa) and similar total dislocation densities (~109/cm2) as compared to the films grown in a H2 environment. On the other hand, AlN films grown in a H2 gas environment have about 33% lesser carbon and 41% lesser oxygen impurities than films grown in a N2 growth environment. The possible mechanisms that influenced the structural quality and impurity incorporation for two different gas environments to grow AlN epilayers in the MOCVD system on sapphire substrates were discussed. 

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4. Rotationally Aligned Hexagonal Boron Nitride on Sapphire by High-Temperature Molecular Beam Epitaxy

   Ryan Page1, Yongjin Cho2 ( July 2019 , Physical review and Physical review letters index)

   Hexagonal boron nitride (hBN) has been grown on sapphire substrates by ultrahigh-temperature molecular beam epitaxy (MBE). A wide range of substrate temperatures and boron fluxes have been explored, revealing that high crystalline quality hBN layers are grown at high substrate temperatures, >1600℃ , and low boron fluxes, ∼1 × 10%& Torr beam equivalent pressure. In situ reflection high-energy electron diffraction revealed the growth of hBN layers with 60° rotational symmetry and the [112+ 0] axis of hBN parallel to the [11+ 00] axis of the sapphire substrate. Unlike the rough, polycrystalline films previously reported, atomic force microscopy and transmission electron microscopy characterization of these films demonstrate smooth, layered, few-nanometer hBN films on a nitridated sapphire substrate. This demonstration of high-quality hBN growth by MBE is a step toward its integration into existing epitaxial growth platforms, applications, and technologies. 

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5. High-Temperature Atomic Layer Deposition of GaN on 1D Nanostructures

   https://doi.org/10.3390/nano10122434  

   Austin, Aaron J. ; Echeverria, Elena ; Wagle, Phadindra ; Mainali, Punya ; Meyers, Derek ; Gupta, Ashish Kumar ; Sachan, Ritesh ; Prassana, S. ; McIlroy, David N. ( December 2020 , Nanomaterials)

   null (Ed.)

   Silica nanosprings (NS) were coated with gallium nitride (GaN) by high-temperature atomic layer deposition. The deposition temperature was 800 °C using trimethylgallium (TMG) as the Ga source and ammonia (NH3) as the reactive nitrogen source. The growth of GaN on silica nanosprings was compared with deposition of GaN thin films to elucidate the growth properties. The effects of buffer layers of aluminum nitride (AlN) and aluminum oxide (Al2O3) on the stoichiometry, chemical bonding, and morphology of GaN thin films were determined with X-ray photoelectron spectroscopy (XPS), high-resolution x-ray diffraction (HRXRD), and atomic force microscopy (AFM). Scanning and transmission electron microscopy of coated silica nanosprings were compared with corresponding data for the GaN thin films. As grown, GaN on NS is conformal and amorphous. Upon introducing buffer layers of Al2O3 or AlN or combinations thereof, GaN is nanocrystalline with an average crystallite size of 11.5 ± 0.5 nm. The electrical properties of the GaN coated NS depends on whether or not a buffer layer is present and the choice of the buffer layer. In addition, the IV curves of GaN coated NS and the thin films (TF) with corresponding buffer layers, or lack thereof, show similar characteristic features, which supports the conclusion that atomic layer deposition (ALD) of GaN thin films with and without buffer layers translates to 1D nanostructures. 

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