Wu, Xuefei, Bordia, Gautam, Streubel, Robert, Hasnain, Jaffar, Pedroso, Cássio C. S., Cohen, Bruce E., Rad, Behzad, Ashby, Paul, Omar, Ahmad K., Geissler, Phillip L., Wang, Dong, Xue, Han, Wang, Jianjun, and Russell, Thomas P.. Ballistic Ejection of Microdroplets from Overpacked Interfacial Assemblies. Advanced Functional Materials 33.20 Web. doi:10.1002/adfm.202213844.

Wu, Xuefei, Bordia, Gautam, Streubel, Robert, Hasnain, Jaffar, Pedroso, Cássio C. S., Cohen, Bruce E., Rad, Behzad, Ashby, Paul, Omar, Ahmad K., Geissler, Phillip L., Wang, Dong, Xue, Han, Wang, Jianjun, & Russell, Thomas P.. Ballistic Ejection of Microdroplets from Overpacked Interfacial Assemblies. Advanced Functional Materials, 33 (20). https://doi.org/10.1002/adfm.202213844

Wu, Xuefei, Bordia, Gautam, Streubel, Robert, Hasnain, Jaffar, Pedroso, Cássio C. S., Cohen, Bruce E., Rad, Behzad, Ashby, Paul, Omar, Ahmad K., Geissler, Phillip L., Wang, Dong, Xue, Han, Wang, Jianjun, and Russell, Thomas P.. "Ballistic Ejection of Microdroplets from Overpacked Interfacial Assemblies". Advanced Functional Materials 33 (20). Country unknown/Code not available: Wiley Blackwell (John Wiley & Sons). https://doi.org/10.1002/adfm.202213844. https://par.nsf.gov/biblio/10413081.

@article{osti_10413081,
place = {Country unknown/Code not available}, title = {Ballistic Ejection of Microdroplets from Overpacked Interfacial Assemblies}, url = {https://par.nsf.gov/biblio/10413081}, DOI = {10.1002/adfm.202213844}, abstractNote = {Not Available}, journal = {Advanced Functional Materials}, volume = {33}, number = {20}, publisher = {Wiley Blackwell (John Wiley & Sons)}, author = {Wu, Xuefei and Bordia, Gautam and Streubel, Robert and Hasnain, Jaffar and Pedroso, Cássio C. S. and Cohen, Bruce E. and Rad, Behzad and Ashby, Paul and Omar, Ahmad K. and Geissler, Phillip L. and Wang, Dong and Xue, Han and Wang, Jianjun and Russell, Thomas P.}, }