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Abstract High performance thermal insulation materials are desired for a wide range of applications in space, buildings, energy, and environments. Here, a facile ambient processing approach is reported to synthesize a highly insulating and flexible monolithic poly(vinyl chloride) aerogel. The thermal conductivity is measured respectively as 28 mW (m K)−1at atmosphere approaching the air conductivity and 7.7 mW (m K)−1under mild evacuation condition. Thermal modeling is performed to understand the thermal conductivity contributions from different heat transport pathways in air and solid. The analysis based on the Knudsen effect and scattering mean free paths shows that the thermal insulation performance can be further improved through the optimization of porous structures to confine the movement of air molecules. Additionally, the prepared aerogels show superhydrophobicity due to the highly porous structures, which enables new opportunities for surface engineering. Together, the study demonstrates an energy‐saving and scalable ambient‐processing pathway to achieve ultralight, flexible, and superhydrophobic poly(vinyl chloride) aerogel for thermal insulation applications.
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This content will become publicly available on December 27, 2025
Low Thermal Conductivity and Diffusivity at High Temperatures Using Stable High‐Entropy Spinel Oxide Nanoparticles
Abstract The realization of low thermal conductivity at high temperatures (0.11 W m−1K−1800 °C) in ambient air in a porous solid thermal insulation material, using stable packed nanoparticles of high‐entropy spinel oxide with 8 cations (HESO‐8 NPs) with a relatively high packing density of ≈50%, is reported. The high‐density HESO‐8 NP pellets possess around 1000‐fold lower thermal diffusivity than that of air, resulting in much slower heat propagation when subjected to a transient heat flux. The low thermal conductivity and diffusivity are realized by suppressing all three modes of heat transfer, namely solid conduction, gas conduction, and thermal radiation, via stable nanoconstriction and infrared‐absorbing nature of the HESO‐8 NPs, which are enabled by remarkable microstructural stability against coarsening at high temperatures due to the high entropy. This work can elucidate the design of the next‐generation high‐temperature thermal insulation materials using high‐entropy ceramic nanostructures.
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- Award ID(s):
- 2005181
- PAR ID:
- 10562343
- Publisher / Repository:
- Wiley Blackwell (John Wiley & Sons)
- Date Published:
- Journal Name:
- Advanced Materials
- Volume:
- 37
- Issue:
- 6
- ISSN:
- 0935-9648
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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