J. Coshatt, Stephen, Li, Qi, Yang, Bowen, Wu, Shuhan, Zahiri, Feraidoon, Shrivastava, Darpan, Ye, Jin, and Song, WenZhan. Design of Cyber-Physical Security Testbed for Multi-Stage Manufacturing System. Retrieved from https://par.nsf.gov/biblio/10436710. IEEE Global Communications Conference . Web. doi:10.1109/GLOBECOM48099.2022.10000849.

J. Coshatt, Stephen, Li, Qi, Yang, Bowen, Wu, Shuhan, Zahiri, Feraidoon, Shrivastava, Darpan, Ye, Jin, & Song, WenZhan. Design of Cyber-Physical Security Testbed for Multi-Stage Manufacturing System. IEEE Global Communications Conference, (). Retrieved from https://par.nsf.gov/biblio/10436710. https://doi.org/10.1109/GLOBECOM48099.2022.10000849

J. Coshatt, Stephen, Li, Qi, Yang, Bowen, Wu, Shuhan, Zahiri, Feraidoon, Shrivastava, Darpan, Ye, Jin, and Song, WenZhan. "Design of Cyber-Physical Security Testbed for Multi-Stage Manufacturing System". IEEE Global Communications Conference (). Country unknown/Code not available. https://doi.org/10.1109/GLOBECOM48099.2022.10000849. https://par.nsf.gov/biblio/10436710.

@article{osti_10436710,
place = {Country unknown/Code not available}, title = {Design of Cyber-Physical Security Testbed for Multi-Stage Manufacturing System}, url = {https://par.nsf.gov/biblio/10436710}, DOI = {10.1109/GLOBECOM48099.2022.10000849}, abstractNote = {}, journal = {IEEE Global Communications Conference}, author = {J. Coshatt, Stephen and Li, Qi and Yang, Bowen and Wu, Shuhan and Zahiri, Feraidoon and Shrivastava, Darpan and Ye, Jin and Song, WenZhan}, }