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Ge1−x−ySixSny alloys were grown on Ge buffers via reactions of SnH4 and GeH3Cl. The latter is a new CVD source designed for epitaxial development of group-IV semiconductors under low thermal budgets and CMOS-compatible conditions. The Ge1−x−ySixSny films were produced at very low temperatures between 160 and 200 °C with 3%–5% Si and ∼5%–11% Sn. The films were characterized using an array of structural probes that include Rutherford backscattering, x-ray photoelectron spectroscopy, high-resolution x-ray diffraction, scanning transmission electron microscopy, and atomic force microscopy. These studies indicate that the films are strained to Ge and exhibit defect-free microstructures, flat surfaces, homogeneous compositions, and sharp interfaces. Raman was used to determine the compositional dependence of the vibrational modes indicating atomic distributions indistinguishable from those obtained when using high-order Ge hydrides. For a better understanding of the growth mechanisms, a parallel study was conducted to investigate the GeH3Cl applicability for synthesis of binary Ge1−ySny films. These grew strained to Ge, but with reduced Sn compositions and lower thicknesses relative to Ge1−x−ySixSny. Bypassing the Ge buffers led to Ge1−ySny-on-Si films with compositions and thicknesses comparable to Ge1−ySny-on-Ge; but their strains were mostly relaxed. Efforts to increase the concentration and thickness of Ge1−ySny-on-Si resulted in multiphase materials containing large amounts of interstitial Sn. These outcomes suggest that the incorporation of even small Si amounts in Ge1−x−ySixSny might compensate for the large Ge–Sn mismatch by lowering bond strains. Such an effect reduces strain energy, enhances stability, promotes higher Sn incorporation, and increases critical thickness.
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Synthesis of short-wave infrared Ge1− y Sn y semiconductors directly on Si(100) via ultralow temperature molecular routes for monolithic integration applications
We report the synthesis of Ge1−ySny films containing 6%–13% Sn directly on Si(100) for monolithic integration applications, circumventing the use of conventional Ge-buffer layers. The films are produced in a gas source molecular epitaxy chamber at ultralow temperatures of 185–210 °C and a pressure of 10−5 Torr by the reactions of pure vapor Ge4H10 and SnD4 or SnH4 without carrier gases. Very small amounts of Si, incorporated via the Si4H10 precursor, can be used to improve the structural properties. All samples were characterized by XRD, RBS, IR-ellipsometry, AFM, and TEM, indicating the formation of monocrystalline single-phase films with relatively low defectivity and flat surfaces. A notable highlight is that the residual strains of the alloy layers are much lower compared to those grown on Ge buffers and can be further reduced by rapid thermal annealing without decomposition, indicating that growth on bare silicon should produce bulklike, high Sn content alloys that cannot be accessed using Ge buffers. N-type analogs of the above samples doped with phosphorus were also produced using P(SiH3)3 as the in situ dopant precursor. The results collectively illustrate the potential of our chemistry-based method to generate good quality Ge1−ySny layers directly on large area Si wafers bypassing Ge buffers that typically lead to complications such as multiple hetero-interfaces and epitaxial breakdown at high Sn concentrations.
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- Award ID(s):
- 2119583
- PAR ID:
- 10447841
- Date Published:
- Journal Name:
- Journal of Vacuum Science & Technology A
- Volume:
- 40
- Issue:
- 6
- ISSN:
- 0734-2101
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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Group IV alloy nanocrystals (NCs) are a class of direct energy gap semiconductors that show high elemental abundance, low to non-toxicity, and composition-tunable absorption and emission properties. These properties have distinguished Ge1-xSnx NCs as an intriguing material for near-infrared (IR) optical studies. Achieving a material with efficient visible emission requires a modified class of Group IV alloys and the computational studies suggest that this can be achieved with Ge1-x-ySiySnx NCs. Herein, we report a colloidal strategy for the synthesis of bulk-like (10.3 ± 2.5 – 25.5 ± 5.3 nm) and quantum-confined (3.2 ± 0.6 – 4.2 ± 1.1 nm) Ge1-x-ySiySnx alloys that show strong size confinement effects and composition-tunable visible to near IR absorption and emission properties. This synthesis produces a homogeneous alloy with diamond cubic Ge structure and tunable Si (0.9 – 16.1%) and Sn (1.8 – 14.9%) compositions, exceeding the equilibrium solubility of Sn (<1%) in crystalline Si and Ge. Raman spectra of Ge1-x-ySiySnx alloys show a prominent redshift of the Ge-Ge peak and the emergence of a Ge-Si peak with increasing Si/Sn, suggesting the growth of homogeneous alloys. The smaller Ge1-x-ySiySnx NCs exhibit absorption onsets from 1.21 to 1.94 eV for x = 1.8 – 6.8% and y = 0.9 – 16.1% compositions, which are blueshifted from those reported for Ge1-x-ySiySnx bulk alloy films and Ge1-xSnx alloy NCs, indicating the influence of Si incorporation and strong size confinement effects. Solid-state photoluminescence (PL) spectra reveal core-related PL maxima from 1.77 – 1.97 eV in agreement with absorption onsets, consistent with the energy gaps calculated for ~3–4 nm alloy NCs. With facile low-temperature solution synthesis and direct control over physical properties, this methodology presents a noteworthy advancement in the synthesis of bulk-like and quantum-confined Ge1-x-ySiySnx alloys as versatile materials for future optical and electronic studies.more » « less
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The near-bandgap optical properties of Ge1-xSnx alloys were characterized by photovoltage spectroscopy and spectral ellipsometry measurements. Contributions of Urbach tailing as well as direct and indirect optical transitions were observed. The compositional dependence of direct bandgaps of strained GeSn films grown on a Ge buffered Si substrate was studied for up to 15% Sn content. The contribution to the photovoltage spectra of Ge1-xSnx alloys (x < 6%) from indirect optical transitions was observed at lower energies than from direct bandgaps. Using bowing parameters, a correlation was detected between calculated and measured indirect and direct bandgaps at 82 K. As the Sn content was increased, the difference between the energies of the indirect and direct bandgaps decreased, resulting in a smaller contribution of the indirect transitions due to competition with direct transitions and Urbach tails. Two sublayers with different Sn content, strain values and bandgaps were observed for samples with x ~12%. The results indicated that strain relaxation in films with thicknesses exceeding a critical value occurs via formation of a Sn-rich top layer with higher direct bandgap. These findings have important implications when designing IR photodetectors or solar cells.more » « less
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Two distinct ultra-thin Ge1−xSnx (x ≤ 0.1) epilayers were deposited on (001) Si substrates at 457 and 313 °C through remote plasma-enhanced chemical vapor deposition. These films are considered potential initiation layers for synthesizing thick epitaxial GeSn films. The GeSn film deposited at 313 °C has a thickness of 10 nm and exhibits a highly epitaxial continuous structure with its lattice being compressed along the interface plane to coherently match Si without mismatch dislocations. The GeSn film deposited at 457 °C exhibits a discrete epitaxial island-like morphology with a peak height of ∼30 nm and full-width half maximum (FWHM) varying from 20 to 100 nm. GeSn islands with an FWHM smaller than 20 nm are defect free, whereas those exceeding 25 nm encompass nanotwins and/or stacking faults. The GeSn islands form two-dimensional modulated superlattice structures at the interface with Si. The GeSn film deposited at 457 °C possesses a lower Sn content compared to the one deposited at lower temperature. The potential impact of using these two distinct ultra-thin layers as initiation layers for the direct growth of thicker GeSn epitaxial films on (001) Si substrates is discussed.more » « less
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A theoretical model that can be used to simultaneously fit the I–V characteristics and spectral optical responsivity of Ge-like pin diodes is described in detail and validated experimentally using specially fabricated Ge- and Ge1−ySny devices. The model combines a numerical solution of the basic semiconductor transport equations with a rigorous calculation of the optical generation rate that accounts for multiple reflections in the device structure multilayers. The results can be used to quantify the reduction of photocurrent associated with recombination centers for full optimization of the device structure.more » « less
- Free Publicly Accessible Full Text
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Accepted Manuscript1.0
- Journal Article:
- https://doi.org/10.1116/6.0002052
