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Abstract Vertically‐stacked organic light emitting diode (OLED) microcavities form 1D metal‐dielectric photonic crystals (MDPC) with many degrees of freedom for engineering complex emission profiles. The photonic band structure of the MDPC OLED is determined by the underlying unit cell and is particularly sensitive to the properties of the metallic electrodes. The electronic requirements of microcavity OLED fabrication often necessitate dissimilar metallic electrodes to achieve good performance. This can profoundly impact the photonic properties of a MDPC by doubling the unit cell length. This work presents a MDPC OLED formed with single‐cavity unit cells by employing optically similar Ag alloys as the semi‐transparent electrode materials. The crystal is found to display a single photonic band without a band gap up to eight stacked cavities. The states within the band are evenly‐spaced and clearly resolved, which is critical for applications seeking to utilize specific photonic states. Design considerations are presented for optimizing the photonic behavior of MDPC OLEDs through selective control of the optical properties of metallic alloys.
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High‐Density Integration of Ultrabright OLEDs on a Miniaturized Needle‐Shaped CMOS Backplane
Abstract Direct deposition of organic light‐emitting diodes (OLEDs) on silicon‐based complementary metal–oxide–semiconductor (CMOS) chips has enabled self‐emissive microdisplays with high resolution and fill‐factor. Emerging applications of OLEDs in augmented and virtual reality (AR/VR) displays and in biomedical applications, e.g., as brain implants for cell‐specific light delivery in optogenetics, require light intensities orders of magnitude above those found in traditional displays. Further requirements often include a microscopic device footprint, a specific shape and ultrastable passivation, e.g., to ensure biocompatibility and minimal invasiveness of OLED‐based implants. In this work, up to 1024 ultrabright, microscopic OLEDs are deposited directly on needle‐shaped CMOS chips. Transmission electron microscopy and energy‐dispersive X‐ray spectroscopy are performed on the foundry‐provided aluminum contact pads of the CMOS chips to guide a systematic optimization of the contacts. Plasma treatment and implementation of silver interlayers lead to ohmic contact conditions and thus facilitate direct vacuum deposition of orange‐ and blue‐emitting OLED stacks leading to micrometer‐sized pixels on the chips. The electronics in each needle allow each pixel to switch individually. The OLED pixels generate a mean optical power density of 0.25 mW mm −2 , corresponding to >40 000 cd m −2 , well above the requirement for daylight AR applications and optogenetic single‐unit activation in the brain.
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- Award ID(s):
- 1706207
- PAR ID:
- 10462938
- Date Published:
- Journal Name:
- Advanced Materials
- ISSN:
- 0935-9648
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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- Free Publicly Accessible Full Text
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Accepted Manuscript1.0
- Journal Article:
- https://doi.org/10.1002/adma.202300578
