design, both inter- and intra-chiplet, impacts overall system performance as well as its manufacturing cost and thermal feasibility. This paper introduces a cross-layer methodology for designing networks in 2.5D systems. We optimize the network design and chiplet placement jointly across logical, physical, and circuit layers to achieve an energy-efficient network, while maximizing system performance, minimizing manufacturing cost, and adhering to thermal constraints. In the logical layer, our co-optimization considers eight different network topologies. In the physical layer, we consider routing, microbump assignment, and microbump pitch constraints to account for the extra costs associated with microbump utilization in the inter-chiplet communication. In the circuit layer, we consider both passive and active links with five different link types, including a gas station link design. Using our cross-layer methodology results in more accurate determination of (superior) inter-chiplet network and 2.5D system designs compared to prior methods. Compared to 2D systems, our approach achieves 29% better performance with the same manufacturing cost, or 25% lower cost with the same performance.
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This content will become publicly available on January 1, 2025
2D, 2.5D, or 3D? An Exploratory Study on Multilayer Network Visualisations in Virtual Reality
Relational information between different types of entities is often modelled by a multilayer network (MLN) – a network with subnetworks represented by layers. The layers of an MLN can be arranged in different ways in a visual representation, however, the impact of the arrangement on the readability of the network is an open question. Therefore, we studied this impact for several commonly occurring tasks related to MLN analysis. Additionally, layer arrangements with a dimensionality beyond 2D, which are common in this scenario, motivate the use of stereoscopic displays. We ran a human subject study utilising a Virtual Reality headset to evaluate 2D, 2.5D, and 3D layer arrangements. The study employs six analysis tasks that cover the spectrum of an MLN task taxonomy, from path finding and pattern identification to comparisons between and across layers. We found no clear overall winner. However, we explore the task-to-arrangement space and derive empirical-based recommendations on the effective use of 2D, 2.5D, and 3D layer arrangements for MLNs.
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- Award ID(s):
- 2212130
- NSF-PAR ID:
- 10493379
- Publisher / Repository:
- IEEE
- Date Published:
- Journal Name:
- IEEE Transactions on Visualization and Computer Graphics
- Volume:
- 30
- Issue:
- 1
- ISSN:
- 1077-2626
- Page Range / eLocation ID:
- 469 to 479
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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