Continuous device downsizing and circuit complexity have motivated atomic-scale tuning of memristors. Herein, we report atomically tunable Pd/M1/M2/Al ultrathin (<2.5 nm M1/M2 bilayer oxide thickness) memristors using in vacuo atomic layer deposition by controlled insertion of MgO atomic layers into pristine Al2O3atomic layer stacks guided by theory predicted Fermi energy lowering leading to a higher high state resistance (HRS) and a reduction of oxygen vacancy formation energy. Excitingly, memristors with HRS and on/off ratio increasing exponentially with M1/M2 thickness in the range 1.2–2.4 nm have been obtained, illustrating tunneling mechanism and tunable on/off ratio in the range of 10–104. Further dynamic tunability of on/off ratio by electric field is possible by designing of the atomic M2 layer and M1/M2 interface. This result probes ways in the design of memristors with atomically tunable performance parameters.
Ultrathin (sub-2 nm) Al2O3/MgO memristors were recently developed using an
- PAR ID:
- 10498322
- Publisher / Repository:
- IOP Publishing
- Date Published:
- Journal Name:
- Nano Express
- Volume:
- 5
- Issue:
- 2
- ISSN:
- 2632-959X
- Format(s):
- Medium: X Size: Article No. 025001
- Size(s):
- Article No. 025001
- Sponsoring Org:
- National Science Foundation
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Ultrathin (1–4 nm) films of wide-bandgap semiconductors are important to many applications in microelectronics, and the film properties can be sensitively affected by defects especially at the substrate/film interface. Motivated by this, an in vacuo atomic layer deposition (ALD) was developed for the synthesis of ultrathin films of Ga2O3/Al2O3 atomic layer stacks (ALSs) on Al electrodes. It is found that the Ga2O3/Al2O3 ALS can form an interface with the Al electrode with negligible interfacial defects under the optimal ALD condition whether the starting atomic layer is Ga2O3 or Al2O3. Such an interface is the key to achieving an optimal and tunable electronic structure and dielectric properties in Ga2O3/Al2O3 ALS ultrathin films. In situ scanning tunneling spectroscopy confirms that the electronic structure of Ga2O3/Al2O3 ALS can have tunable bandgaps (Eg) between ∼2.0 eV for 100% Ga2O3 and ∼3.4 eV for 100% Al2O3. With variable ratios of Ga:Al, the measured Eg exhibits significant non-linearity, agreeing with the density functional theory simulation, and tunable carrier concentration. Furthermore, the dielectric constant ε of ultrathin Ga2O3/Al2O3 ALS capacitors is tunable through the variation in the ratio of the constituent Ga2O3 and Al2O3 atomic layer numbers from 9.83 for 100% Ga2O3 to 8.28 for 100% Al2O3. The high ɛ leads to excellent effective oxide thickness ∼1.7–2.1 nm for the ultrathin Ga2O3/Al2O3 ALS, which is comparable to that of high-K dielectric materials.
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By mimicking biomimetic synaptic processes, the success of artificial intelligence (AI) has been astounding with various applications such as driving automation, big data analysis, and natural-language processing.[1-4] Due to a large quantity of data transmission between the separated memory unit and the logic unit, the classical computing system with von Neumann architecture consumes excessive energy and has a significant processing delay.[5] Furthermore, the speed difference between the two units also causes extra delay, which is referred to as the memory wall.[6, 7] To keep pace with the rapid growth of AI applications, enhanced hardware systems that particularly feature an energy-efficient and high-speed hardware system need to be secured. The novel neuromorphic computing system, an in-memory architecture with low power consumption, has been suggested as an alternative to the conventional system. Memristors with analog-type resistive switching behavior are a promising candidate for implementing the neuromorphic computing system since the devices can modulate the conductance with cycles that act as synaptic weights to process input signals and store information.[8, 9]
The memristor has sparked tremendous interest due to its simple two-terminal structure, including top electrode (TE), bottom electrode (BE), and an intermediate resistive switching (RS) layer. Many oxide materials, including HfO2, Ta2O5, and IGZO, have extensively been studied as an RS layer of memristors. Silicon dioxide (SiO2) features 3D structural conformity with the conventional CMOS technology and high wafer-scale homogeneity, which has benefited modern microelectronic devices as dielectric and/or passivation layers. Therefore, the use of SiO2as a memristor RS layer for neuromorphic computing is expected to be compatible with current Si technology with minimal processing and material-related complexities.
In this work, we proposed SiO2-based memristor and investigated switching behaviors metallized with different reduction potentials by applying pure Cu and Ag, and their alloys with varied ratios. Heavily doped p-type silicon was chosen as BE in order to exclude any effects of the BE ions on the memristor performance. We previously reported that the selection of TE is crucial for achieving a high memory window and stable switching performance. According to the study which compares the roles of Cu (switching stabilizer) and Ag (large switching window performer) TEs for oxide memristors, we have selected the TE materials and their alloys to engineer the SiO2-based memristor characteristics. The Ag TE leads to a larger memory window of the SiO2memristor, but the device shows relatively large variation and less reliability. On the other hand, the Cu TE device presents uniform gradual switching behavior which is in line with our previous report that Cu can be served as a stabilizer, but with small on/off ratio.[9] These distinct performances with Cu and Ag metallization leads us to utilize a Cu/Ag alloy as the TE. Various compositions of Cu/Ag were examined for the optimization of the memristor TEs. With a Cu/Ag alloying TE with optimized ratio, our SiO2based memristor demonstrates uniform switching behavior and memory window for analog switching applications. Also, it shows ideal potentiation and depression synaptic behavior under the positive/negative spikes (pulse train).
In conclusion, the SiO2memristors with different metallization were established. To tune the property of RS layer, the sputtering conditions of RS were varied. To investigate the influence of TE selections on switching performance of memristor, we integrated Cu, Ag and Cu/Ag alloy as TEs and compared the switch characteristics. Our encouraging results clearly demonstrate that SiO2with Cu/Ag is a promising memristor device with synaptic switching behavior in neuromorphic computing applications.
Acknowledgement This work was supported by the U.S. National Science Foundation (NSF) Award No. ECCS-1931088. S.L. and H.W.S. acknowledge the support from the Improvement of Measurement Standards and Technology for Mechanical Metrology (Grant No. 22011044) by KRISS.
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Abstract This work evaluates the passivation efficacy of thermal atomic layer deposited (ALD) Al 2 O 3 dielectric layer on self-catalyzed GaAs 1- x Sb x nanowires (NWs) grown using molecular beam epitaxy. A detailed assessment of surface chemical composition and optical properties of Al 2 O 3 passivated NWs with and without prior sulfur treatment were studied and compared to as-grown samples using x-ray photoelectron spectroscopy (XPS), Raman spectroscopy, and low-temperature photoluminescence (PL) spectroscopy. The XPS measurements reveal that prior sulfur treatment followed by Al 2 O 3 ALD deposition abates III–V native oxides from the NW surface. However, the degradation in 4K-PL intensity by an order of magnitude observed for NWs with Al 2 O 3 shell layer compared to the as-grown NWs, irrespective of prior sulfur treatment, suggests the formation of defect states at the NW/dielectric interface contributing to non-radiative recombination centers. This is corroborated by the Raman spectral broadening of LO and TO Raman modes, increased background scattering, and redshift observed for Al 2 O 3 deposited NWs relative to the as-grown. Thus, our work seems to indicate the unsuitability of ALD deposited Al 2 O 3 as a passivation layer for GaAsSb NWs.more » « less
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Abstract In recent years, area‐selective atomic layer deposition (AS‐ALD) has attracted increasing interest for its applications in back‐end interconnect processes, and selective deposition of Al2O3is of particular interest because Al2O3can serve as an etch hard mask. However, Al2O3is one of the most difficult ALD systems to block. In this work, a strategy is presented to enhance the blocking ability of dodecanethiol (DDT) self‐assembled monolayers (SAMs) against Al2O3ALD. It is shown that by conducting DDT deposition on a slightly oxidized Cu surface, which is mainly composed of Cu2O, rather than on a freshly acid‐etched Cu surface, which mainly consists of metallic Cu, the quality of the DDT SAM can be improved. It is further shown that the DDT SAMs formed on Cu2O‐covered Cu substrates are about 3–4 times more effective in blocking Al2O3than that on acid‐etched Cu surfaces when ALD is performed under subsaturation condition. However, as the Cu oxidation process continues, CuO is formed and the blocking ability of DDT degrades. Finally, selective Al2O3deposition on DDT‐treated Cu/low‐
k patterns using the combined strategy of Cu oxidation and subsaturation conditions achieves selectivity of 0.99 after 4 nm of Al2O3ALD.
