DeepOHeat: Operator Learning-based Ultra-fast Thermal Simulation in 3D-IC Design
- Award ID(s):
- 1846476
- NSF-PAR ID:
- 10499329
- Publisher / Repository:
- IEEE
- Date Published:
- ISBN:
- 979-8-3503-2348-1
- Page Range / eLocation ID:
- 1 to 6
- Format(s):
- Medium: X
- Location:
- San Francisco, CA, USA
- Sponsoring Org:
- National Science Foundation
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