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Abstract One of the major challenges in the van der Waals (vdW) integration of two-dimensional (2D) materials is achieving high-yield and high-throughput assembly of predefined sequences of monolayers into heterostructure arrays. Mechanical exfoliation has recently been studied as a promising technique to transfer monolayers from a multilayer source synthesized by other techniques, allowing the deposition of a wide variety of 2D materials without exposing the target substrate to harsh synthesis conditions. Although a variety of processes have been developed to exfoliate the 2D materials mechanically from the source and place them deterministically onto a target substrate, they can typically transfer only either a wafer-scale blanket or one small flake at a time with uncontrolled size and shape. Here, we present a method to assemble arrays of lithographically defined monolayer WS2 and MoS2 features from multilayer sources and directly transfer them in a deterministic manner onto target substrates. This exfoliate–align–release process—without the need of an intermediate carrier substrate—is enabled by combining a patterned, gold-mediated exfoliation technique with a new optically transparent, heat-releasable adhesive. WS2/MoS2 vdW heterostructure arrays produced by this method show the expected interlayer exciton between the monolayers. Light-emitting devices using WS2 monolayers were also demonstrated, proving the functionality of the fabricated materials. Our work demonstrates a significant step toward developing mechanical exfoliation as a scalable dry transfer technique for the manufacturing of functional, atomically thin materials.
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Semi-Automated Soft Robotic Stamp Transfer Machine for Van Der Waals Heterostructure Device Assembly
Monolayer materials can be vertically stacked into artificial solids, known as the van der Waals heterostructures (vd-WHs) [1], to realize a new class of ultrathin optoelectronic, electronic, and quantum devices, which have significant potential to revolutionize the field of nanoelectronics and impact a wide range of application areas including transparent displays, sensor arrays, and logic and memory circuits. However, today’s assembly of vdWH devices is still primarily through manual manipulation, which lacks the precision and repeatability needed for the scalable manufacturing of wafer-scale vdWH device arrays outside a research setting. Aiming to enable the automated, scalable, and repeatable manufacturing of vdWH device arrays, this paper presents the design, prototyping, and preliminary tests of a novel semi-automated soft-robotic stamp transfer system for thin-film materials. The system uses a dry elastomer stamp with its adhesion controlled by temperature and peeling speed for material transfer. A combination of electromagnetic and pneumatic actuation is used for the soft-robotic stamp to realize a gentle and uniform pressing of the stamp over the material. An optical microscope, force sensors, and temperature sensors are integrated to enable instrumentation of the transfer process. Preliminary experiments were conducted using our system to conduct for exfoliated graphite transfer. Test results demonstrate the reliable and repeatable transfer of 2D crystal flakes, which show promise to enable the deterministic and scalable assembly of vdWH-based device arrays at wafer scale.
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- Award ID(s):
- 2243477
- PAR ID:
- 10501585
- Publisher / Repository:
- American Society of Mechanical Engineers
- Date Published:
- ISBN:
- 978-0-7918-8724-0
- Format(s):
- Medium: X
- Location:
- New Brunswick, New Jersey, USA
- Sponsoring Org:
- National Science Foundation
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