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Title: Thermal Exploration of RSFQ Integrated Circuits
Award ID(s):
2308863 2124453
PAR ID:
10529378
Author(s) / Creator(s):
;
Publisher / Repository:
IEEE
Date Published:
Journal Name:
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Volume:
32
Issue:
4
ISSN:
1063-8210
Page Range / eLocation ID:
728 to 738
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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