Microplasticity in polycrystalline materials from thermal cycling
- Award ID(s):
- 2051390
- PAR ID:
- 10540348
- Publisher / Repository:
- Springer
- Date Published:
- Journal Name:
- Computational Mechanics
- ISSN:
- 0178-7675
- Subject(s) / Keyword(s):
- Crystal plasticity Thermomechanical modeling Residual stress Residual dislocation density Residual lattice rotation
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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