Ultrathin, Lightweight Materials Enabled Wireless Data and Power Transmission in Chip-Less Flexible Electronics
- Award ID(s):
- 2223387
- PAR ID:
- 10556197
- Publisher / Repository:
- American Chemical Society
- Date Published:
- Journal Name:
- ACS Materials Au
- Volume:
- 5
- Issue:
- 1
- ISSN:
- 2694-2461
- Format(s):
- Medium: X Size: p. 45-56
- Size(s):
- p. 45-56
- Sponsoring Org:
- National Science Foundation
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