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Title: Computational Design of Wiring Layout on Tight Suits with Minimal Motion Resistance
Award ID(s):
2007661
PAR ID:
10558864
Author(s) / Creator(s):
; ; ; ; ; ;
Publisher / Repository:
ACM SIGGRAPH Asia 2023 Conference Papers
Date Published:
ISBN:
9798400703157
Page Range / eLocation ID:
1 to 12
Format(s):
Medium: X
Location:
Sydney NSW Australia
Sponsoring Org:
National Science Foundation
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