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Title: Converter-Level Packaging and Optimization for a SiC-Based Grid-Interface Converter Using Discrete Devices
Award ID(s):
2143112 1846917
PAR ID:
10565295
Author(s) / Creator(s):
; ; ; ;
Publisher / Repository:
IEEE
Date Published:
Journal Name:
IEEE Transactions on Components, Packaging and Manufacturing Technology
Volume:
14
Issue:
12
ISSN:
2156-3950
Page Range / eLocation ID:
2157 to 2176
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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