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Abstract The microstructures of materials typically undergo significant changes during shock loading, causing failure when higher shock pressures are reached. However, preservation of microstructural and mechanical integrity during shock loading are essential in situations such as space travel, nuclear energy, protection systems, extreme geological events, and transportation. Here, we report ex situ shock behavior of a chemically optimized and microstructurally stable, bulk nanocrystalline copper–tantalum alloy that shows a relatively unchanged microstructure or properties when shock compressed up to 15 GPa. The absence of shock-hardening indicates that the grains and grain boundaries that make up the stabilized nanocrystalline microstructure act as stable sinks, thereby annihilating deformation-induced defects during shock loading. This study helps to advance the possibility of developing advanced structural materials for extreme applications where shock loading occurs.
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Grain rotation mechanisms in nanocrystalline materials: Multiscale observations in Pt thin films
Near-rigid-body grain rotation is commonly observed during grain growth, recrystallization, and plastic deformation in nanocrystalline materials. Despite decades of research, the dominant mechanisms underlying grain rotation remain enigmatic. We present direct evidence that grain rotation occurs through the motion of disconnections (line defects with step and dislocation character) along grain boundaries in platinum thin films. State-of-the-art in situ four-dimensional scanning transmission electron microscopy (4D-STEM) observations reveal the statistical correlation between grain rotation and grain growth or shrinkage. This correlation arises from shear-coupled grain boundary migration, which occurs through the motion of disconnections, as demonstrated by in situ high-angle annular dark-field STEM observations and the atomistic simulation–aided analysis. These findings provide quantitative insights into the structural dynamics of nanocrystalline materials.
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- Award ID(s):
- 2011967
- PAR ID:
- 10590397
- Publisher / Repository:
- American Association for the Advancement of Science
- Date Published:
- Journal Name:
- Science
- Volume:
- 386
- Issue:
- 6717
- ISSN:
- 0036-8075
- Page Range / eLocation ID:
- 49 to 54
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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- Free Publicly Accessible Full Text
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Accepted Manuscript1.0
- Journal Article:
- https://doi.org/10.1126/science.adk6384
