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1. Chiplet-GAN: Chiplet-based Accelerator Design for Scalable Generative Adversarial Network Inference

   Chen, Yuechen; Louri, Ahmed; Lombardi, Fabrizio; Liu, Shanshan (August 2024, IEEE Circuits and System)

   Generative adversarial networks (GANs) have emerged as a powerful solution for generating synthetic data when the availability of large, labeled training datasets is limited or costly in large-scale machine learning systems. Recent advancements in GAN models have extended their applications across diverse domains, including medicine, robotics, and content synthesis. These advanced GAN models have gained recognition for their excellent accuracy by scaling the model. However, existing accelerators face scalability challenges when dealing with large-scale GAN models. As the size of GAN models increases, the demand for computation and communication resources during inference continues to grow. To address this scalability issue, this article proposes Chiplet-GAN, a chiplet-based accelerator design for GAN inference. Chiplet-GAN enables scalability by adding more chiplets to the system, thereby supporting the scaling of computation capabilities. To handle the increasing communication demand as the system and model scale, a novel interconnection network with adaptive topology and passive/active network links is developed to provide adequate communication support for Chiplet-GAN. Coupled with workload partition and allocation algorithms, Chiplet-GAN reduces execution time and energy consumption for GAN inference workloads as both model and chiplet-system scales. Evaluation results using various GAN models show the effectiveness of Chiplet-GAN. On average, compared to GANAX, SpAtten, and Simba, the Chiplet-GAN reduces execution time and energy consumption by 34% and 21%, respectively. Furthermore, as the system scales for large-scale GAN model inference, Chiplet-GAN achieves reductions in execution time of up to 63% compared to the Simba, a chiplet-based accelerator. 

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2. Chiplet-GAN: Chiplet-Based Accelerator Design for Scalable Generative Adversarial Network Inference [Feature]

   Yuechen, Chen; Ahmed, Louri; Fabrizio, Lombardi; Shanshan, Liu (August 2024, IEEE circuits and systems magazine)

   Generative adversarial networks (GANs) have emerged as a powerful solution for generating synthetic data when the availability of large, labeled training datasets is limited or costly in large-scale machine learning systems. Recent advancements in GAN models have extended their applications across diverse domains, including medicine, robotics, and content synthesis. These advanced GAN models have gained recognition for their excellent accuracy by scaling the model. However, existing accelerators face scalability challenges when dealing with large-scale GAN models. As the size of GAN models increases, the demand for computation and communication resources during inference continues to grow. To address this scalability issue, this article proposes Chiplet-GAN, a chiplet-based accelerator design for GAN inference. Chiplet-GAN enables scalability by adding more chiplets to the system, thereby supporting the scaling of computation capabilities. To handle the increasing communication demand as the system and model scale, a novel interconnection network with adaptive topology and passive/active network links is developed to provide adequate communication support for Chiplet-GAN. Coupled with workload partition and allocation algorithms, Chiplet-GAN reduces execution time and energy consumption for GAN inference workloads as both model and chiplet-system scales. Evaluation results using various GAN models show the effectiveness of Chiplet-GAN. On average, compared to GANAX, SpAtten, and Simba, the Chiplet-GAN reduces execution time and energy consumption by 34% and 21%, respectively. Furthermore, as the system scales for large-scale GAN model inference, Chiplet-GAN achieves reductions in execution time of up to 63% compared to the Simba, a chiplet-based accelerator. 

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3. ChipletQuake: On-Die Digital Impedance Sensing for Chiplet and Interposer Verification

   https://doi.org/10.3390/s25154861  

   Khalaj_Monfared, Saleh; Saadat_Safa, Maryam; Tajik, Shahin (August 2025, Sensors)

   The increasing complexity and cost of manufacturing monolithic chips have driven the semiconductor industry toward chiplet-based designs, where smaller, modular chiplets are integrated onto a single interposer. While chiplet architectures offer significant advantages, such as improved yields, design flexibility, and cost efficiency, they introduce new security challenges in the horizontal hardware manufacturing supply chain. These challenges include risks of hardware Trojans, cross-die side-channel and fault injection attacks, probing of chiplet interfaces, and intellectual property theft. To address these concerns, this paper presents ChipletQuake, a novel on-chiplet framework for verifying the physical security and integrity of adjacent chiplets during the post-silicon stage. By sensing the impedance of the power delivery network (PDN) of the system, ChipletQuake detects tamper events in the interposer and neighboring chiplets without requiring any direct signal interface or additional hardware components. Fully compatible with the digital resources of FPGA-based chiplets, this framework demonstrates the ability to identify the insertion of passive and subtle malicious circuits, providing an effective solution to enhance the security of chiplet-based systems. To validate our claims, we showcase how our framework detects hardware Trojans and interposer tampering. 

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4. Fast thermal analysis for chiplet design based on graph convolution networks

   Chen, L.; Jin, W.; Tan, S. (January 2022, Proc. Asia South Pacific Design Automation Conference (ASP-DAC’22))

   2.5D chiplet-based technology promises an efficient integration technique for advanced designs with more functionality and higher performance. Temperature and related thermal optimization, heat removal are of critical importance for temperature-aware physical synthesis for chiplets. This paper presents a novel graph convolutional networks (GCN) architecture to estimate the thermal map of the 2.5D chiplet-based systems with the thermal resistance networks built by the compact thermal model (CTM). First, we take the total power of all chiplets as an input feature, which is a global feature. This additional global information can overcome the limitation that the GCN can only extract local information via neighborhood aggregation. Second, inspired by convolutional neural networks (CNN), we add skip connection into the GCN to pass the global feature directly across the hidden layers with the concatenation operation. Third, to consider the edge embedding feature, we propose an edge-based attention mechanism based on the graph attention networks (GAT). Last, with the multiple aggregators and scalers of principle neighborhood aggregation (PNA) networks, we can further improve the modeling capacity of the novel GCN. The experimental results show that the proposed GCN model can achieve an average RMSE of 0.31 K and deliver a 2.6$$\times$$ speedup over the fast steady-state solver of open-source {\it HotSpot} based on SuperLU. More importantly, the GCN model demonstrates more useful generalization or transferable capability. Our results show that the trained GCN can be directly applied to predict thermal maps of six unseen datasets with acceptable mean RMSEs of less than 0.67 K without retraining via inductive learning. 

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5. Scaling Deep-Learning Inference with Chiplet-based Architecture and Photonic Interconnects

   https://doi.org/10.1109/DAC18074.2021.9586311  

   Li, Yuan; Louri, Ahmed; Karanth, Avinash (December 2021, 58th ACM/IEEE Design Automation Conference (DAC))

   Chiplet-based architectures have been proposed to scale computing systems for deep neural networks (DNNs). Prior work has shown that for the chiplet-based DNN accelerators, the electrical network connecting the chiplets poses a major challenge to system performance, energy consumption, and scalability. Some emerging interconnect technologies such as silicon photonics can potentially overcome the challenges facing electrical interconnects as photonic interconnects provide high bandwidth density, superior energy efficiency, and ease of implementing broadcast and multicast operations that are prevalent in DNN inference. In this paper, we propose a chiplet-based architecture named SPRINT for DNN inference. SPRINT uses a global buffer to simplify the data transmission between storage and computation, and includes two novel designs: (1) a reconfigurable photonic network that can support diverse communications in DNN inference with minimal implementation cost, and (2) a customized dataflow that exploits the ease of broadcast and multicast feature of photonic interconnects to support highly parallel DNN computations. Simulation studies using ResNet50 DNN model show that SPRINT achieves 46% and 61% execution time and energy consumption reduction, respectively, as compared to other state-of-the-art chiplet-based architectures with electrical or photonic interconnects. 

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