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Title: Heterogeneous Integration of Biasing Circuits for mmWave Reconfigurable Intelligent Surfaces
Award ID(s):
1847138
PAR ID:
10593285
Author(s) / Creator(s):
; ; ;
Publisher / Repository:
IEEE
Date Published:
ISBN:
978-1-946815-19-4
Page Range / eLocation ID:
91 to 92
Format(s):
Medium: X
Location:
Boulder, CO, USA
Sponsoring Org:
National Science Foundation
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