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Grain boundary properties and microstructure evolution in an Al-Cu alloy
- Award ID(s):
- 2118945
- PAR ID:
- 10611998
- Publisher / Repository:
- Elsevier
- Date Published:
- Journal Name:
- Acta Materialia
- Volume:
- 292
- Issue:
- C
- ISSN:
- 1359-6454
- Page Range / eLocation ID:
- 121041
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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