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This work presents fabrication techniques for achieving individual electronic components both on the surface and within the fibers of a paper substrate, attaining full integration of paper and functional electronics materials. A process of hydrophobic wax patterning coupled with conductive and semiconductive poly(3,4-ethylenedioxythiophene): poly(styrene sulfonic acid) (PEDOT: PSS)-based ink injection and screen-printing has allowed for the implementation of all-paper-based, tunable resistors, capacitors, and transistors. The characteristics of the paper resistors can be adjusted as desired through finetuning of the PEDOT: PSS- based ink recipe, and the components can be combined in various arrangements to attain paper-based printed circuit boards (PCBs) for a wide range of practical applications. As a first step towards multiple component integration, a simple example circuit design is demonstrated that incorporates the three different components. Furthermore, through the strategic organization of the resistors, transistors, and capacitors and stacking of paper layers, more complex and diverse paper PCBs can be attained while minimizing the perceived surface area of the circuitry, allowing for a compact, pliable, and highly customizable means of fabricating paper-based electronic systems.