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High-speed channel interconnect modeling and cascaded simulation methods extended to higher bandwidth up to 75 GHz are proposed to simulate the high-speed channels from packaging to PCB to support higher data rates and increasing Nyquist frequencies. The method is capable for evaluation of 224 G/lane PAM4 and higher data rates with higher number of pulse amplitudes application. Cascading methodology is proposed to mainly reduce the complexity of simulating the full channel for faster evaluation with acceptable accuracy by selecting appropriate segmentation planes and ports. Together with modeling for high-speed 3D interconnects among silicon die, package substrate and PCB for the evaluation of the entire channel, such as the C4 bump, solder ball and intra-connections. The methodology is validated through the performance of simulation results based on S- parameters and TDR. Different scenarios of packaging, including co-package copper application, are used to validate the proposed method. The theory of cascading methodology to support the entire high-speed channel evaluation is analyzed in different scenarios to provide clear guideline on how to obtain accurate and fast high-speed channel simulation from package to PCB up to 75 GHz.