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Controlling heat flow is a key challenge for applications ranging from thermal management in electronics to energy systems, industrial processing, and thermal therapy. However, progress has generally been limited by slow response times and low tunability in thermal conductance. In this work, we demonstrate an electronically gated solid-state thermal switch using self-assembled molecular junctions to achieve excellent performance at room temperature. In this three-terminal device, heat flow is continuously and reversibly modulated by an electric field through carefully controlled chemical bonding and charge distributions within the molecular interface. The devices have ultrahigh switching speeds above 1 megahertz, have on/off ratios in thermal conductance greater than 1300%, and can be switched more than 1 million times. We anticipate that these advances will generate opportunities in molecular engineering for thermal management systems and thermal circuit design. 

Thermal management plays a key role in improving the energy efficiency and sustainability of future building envelopes. Here, we focus on the materials perspective and discuss the fundamental needs, current status, and future opportunities for thermal management of buildings. First, we identify the primary considerations and evaluation criteria for high-performance thermal materials. Second, state-of-the-art thermal materials are reviewed, ranging from conventional thermal insulating fiberglass, mineral wool, cellulose, and foams, to aerogels and mesoporous structures, as well as multifunctional thermal management materials. Further, recent progress on passive regulation and thermal energy storage systems are discussed, including sensible heat storage, phase change materials, and radiative cooling. Moreover, we discuss the emerging materials systems with tunable thermal and other physical properties that could potentially enable dynamic and interactive thermal management solutions for future buildings. Finally, we discuss the recent progress in theory and computational design from first-principles atomistic theory, molecular dynamics, to multiscale simulations and machine learning. We expect the rational design that combines data-driven computation and multiscale experiments could bridge the materials properties from microscopic to macroscopic scales and provide new opportunities in improving energy efficiency and enabling adaptive implementation per customized demand for future buildings. 

Abstract Thermal management is the most critical technology challenge for modern electronics. Recent key materials innovation focuses on developing advanced thermal interface of electronic packaging for achieving efficient heat dissipation. Here, for the first time we report a record-high performance thermal interface beyond the current state of the art, based on self-assembled manufacturing of cubic boron arsenide (s-BAs). The s-BAs exhibits highly desirable characteristics of high thermal conductivity up to 21 W/m·K and excellent elastic compliance similar to that of soft biological tissues down to 100 kPa through the rational design of BAs microcrystals in polymer composite. In addition, the s-BAs demonstrates high flexibility and preserves the high conductivity over at least 500 bending cycles, opening up new application opportunities for flexible thermal cooling. Moreover, we demonstrated device integration with power LEDs and measured a superior cooling performance of s-BAs beyond the current state of the art, by up to 45 °C reduction in the hot spot temperature. Together, this study demonstrates scalable manufacturing of a new generation of energy-efficient and flexible thermal interface that holds great promise for advanced thermal management of future integrated circuits and emerging applications such as wearable electronics and soft robotics. 

Thermal management is becoming a critical technology challenge for modern electronics with decreasing device size and increasing power density. One key materials innovation is the development of advanced thermal interfaces in electronic packaging to enable efficient heat dissipation and improve device performance, which has attracted intensive research efforts from both academia and industry over the past several decades. Here we review the recent progress in both theory and experiment for developing high-performance thermal interface materials. First, the basic theories and computational frameworks for interface energy transport are discussed, ranging from atomistic interface scattering to multiscale disorders that contributed to thermal boundary resistance. Second, state-of-the-art experimental techniques including steady-state and transient thermal measurements are discussed and compared. Moreover, the important structure design, requirements, and property factors for thermal interface materials depending on different applications are summarized and exemplified with the recent literature. Finally, emerging new semiconductors and polymers with high thermal conductivity are briefly reviewed and opportunities for future research are discussed. 

ABSTRACT In this work, we update and develop algorithms for KMTNet tender-love care (TLC) photometry in order to create a new, mostly automated, TLC pipeline. We then start a project to systematically apply the new TLC pipeline to the historic KMTNet microlensing events, and search for buried planetary signals. We report the discovery of such a planet candidate in the microlensing event MOA-2019-BLG-421/KMT-2019-BLG-2991. The anomalous signal can be explained by either a planet around the lens star or the orbital motion of the source star. For the planetary interpretation, despite many degenerate solutions, the planet is most likely to be a Jovian planet orbiting an M or K dwarf, which is a typical microlensing planet. The discovery proves that the project can indeed increase the sensitivity of historic events and find previously undiscovered signals.