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Several research studies have investigated the degradation of BaTiO3-based dielectric capacitor materials, focusing on the impact of composition, defect chemistry, and microstructural design to limit the electromigration of oxygen vacancies under electric fields at finite temperatures. Electromigration can be a dominant mechanism that controls failure rates in the individual multilayer ceramic capacitor (MLCC) components in testing the reliability of failures with highly accelerated lifetime testing (HALT) to determine the mean time to failure of MLCCs surface mounted onto printed circuit boards (PCBs). Conventional assumptions often consider these failures as independent, with no interaction between components on the PCB. However, this study employs a Physics of Failure (PoF) approach to closely examine transient degradation and its impact on MLCC reliability, emphasizing thermal crosstalk and its influence on dependent and independent failure rates. Finite element analysis thermal modeling and infrared thermography were used to assess the impact of circuit layout and component spacing on heat dissipation and thermal crosstalk under various electrical stress conditions. The study distinguishes between dependent and independent failures under a HALT, quantified through a β′ factor reflecting common cause failures due to thermal crosstalk. Through a series of experimental and statistical analyses, the β′ factor is evaluated with respect to temperature, voltage, and component spacing. These insights highlight the importance of understanding the nature of the data in reliability testing of MLCCs and optimizing the layout design of high-density circuits to mitigate dependent failures, improving overall reliability and informing better design and packaging strategies. 

Abstract To fulfill the demands of more bandwidth in 5G and 6G communication technology, new dielectric substrates that can be co‐fired into packages and devices that have low dielectric loss and improved thermal conductivity are desired. The motivation for this study is to design composites with low dielectric loss (tan δ) and high thermal conductivity (κ), while still limiting the electrical conductivity, for microwave applications involving high power and high frequency. This work describes the fabrication of high‐density electroceramic composites with a model dielectric material for cold sintering, namely sodium molybdate (Na₂Mo₂O₇), and fillers with higher thermal conductivity such as hexagonal boron nitride. The physical properties of the composites were characterized as a function of filler vol.%, temperature, and frequency. Understanding the variation in measured properties is achieved through analyzing the respective transport mechanisms.