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Herein, a finite element simulation framework for phase‐change memory devices that simultaneously solves for current continuity, electrothermal heating, and crystallization–amorphization dynamics using electrothermal models and dynamic material parameters that are functions of electric field and temperature is described. In this latest model, an electric field‐ and temperature‐dependent electrical conductivity model of stable amorphous Ge₂Sb₂Te₅(GST) obtained from experiments performed on GST line cells to study Read, Reset, and Set operations of mushroom cells is incorporated. The effects of current polarity, heater height, Reset pulse rise and fall times, access device configuration, and ambient temperature are analyzed. The simulation results predict a 2x change in Reset current requirements with different current polarity due to thermoelectric effects. Heater height plays a significant role in thermal losses; ≈16% decrease in Reset current for 4x increase in the heater height is obtained. Increase in the ambient temperature results in a linear decrease in the Reset power required to achieve the same Reset/Set resistance contrast. 

Herein, logic function implementations are computationally demonstrated using lateral and vertical multicontact phase‐change devices integrated with complementary metal–oxide–semiconductor (CMOS) circuitry, which use thermal cross‐talk as a coupling mechanism to implement logic functions at smaller CMOS footprints. Thermal cross‐talk during the write operations is utilized to recrystallize the previously amorphized regions to achieve toggle operations. Amorphized regions formed between different pairs of write contacts are utilized to isolate read contacts. Typical expected reduction in CMOS footprint is ≈50% using the described approach for toggle‐multiplexing, JK‐multiplexing, and 2 × 2 routing. The switching speeds of the phase‐change devices are in the order of nanoseconds and are inherently nonvolatile. An electrothermal modeling framework with dynamic materials models is used to capture the device dynamics, and current and voltage requirements.