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This article, for the first time, demonstrates Cross-device Deep Learning Side-Channel Attack (X-DeepSCA), achieving an accuracy of > 99.9%, even in presence of significantly higher inter-device variations compared to the inter-key variations. Augmenting traces captured from multiple devices for training and with proper choice of hyper-parameters, the proposed 256-class Deep Neural Network (DNN) learns accurately from the power side-channel leakage of an AES-128 target encryption engine, and an N-trace (N ≤ 10) X-DeepSCA attack breaks different target devices within seconds compared to a few minutes for a correlational power analysis (CPA) attack, thereby increasing the threat surface for embedded devices significantly. Even for low SNR scenarios, the proposed X-DeepSCA attack achieves ~10× lower minimum traces to disclosure (MTD) compared to a traditional CPA. 

Physical unclonable functions (PUF) in silicon exploit die-to-die manufacturing variations during fabrication for uniquely identifying each die. Since it is practically a hard problem to recreate exact silicon features across dies, a PUF-based authentication system is robust, secure and cost-effective, as long as bias removal and error correction are taken into account. In this work, we utilize the effects of inherent process variation on analog and radio-frequency (RF) properties of multiple wireless transmitters (Tx) in a sensor network, and detect the features at the receiver (Rx) using a deep neural network based framework. The proposed mechanism/ framework, called RF-PUF, harnesses already-existing RF communication hardware and does not require any additional PUF-generation circuitry in the Tx for practical implementation. Simulation results indicate that the RF-PUF framework can distinguish up to 10000 transmitters (with standard foundry defined variations for a 65 nm process, leading to non-idealities such as LO offset and I-Q imbalance) under varying channel conditions, with a probability of false detection <10^-3