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Abstract Multidimensional power devices can achieve performance beyond conventional limits by deploying charge‐balanced p‐n junctions. A key obstacle to developing such devices in many wide‐bandgap (WBG) and ultra‐wide bandgap (UWBG) semiconductors is the difficulty of native p‐type doping. Here the WBG nickel oxide (NiO) as an alternative p‐type material is investigated. The acceptor concentration (N_A) in NiO is modulated by oxygen partial pressure during magnetron sputtering and characterized using a p‐n⁺heterojunction diode fabricated on gallium oxide (Ga₂O₃) substrate. Capacitance and breakdown measurements reveal a tunableN_Afrom < 10¹⁸ cm⁻³to 2×10¹⁸ cm⁻³with the practical breakdown field (E_B) of 3.8 to 6.3 MV cm⁻¹. ThisN_Arange allows for charge balance to n‐type region with reasonable process latitude, andE_Bis high enough to pair with many WBG and UWBG semiconductors. The extractedN_Ais then used to design a multidimensional Ga₂O₃diode with NiO field‐modulation structure. The diodes fabricated with two differentN_Aboth achieve 8000 V breakdown voltage and 4.7 MV cm⁻¹average electric field. This field is over three times higher than the best report in prior multi‐kilovolt lateral devices. These results show the promise of p‐type NiO for pushing the performance limits of power devices. 

Abstract Power semiconductor devices are fundamental drivers for advances in power electronics, the technology for electric energy conversion. Power devices based on wide-bandgap (WBG) and ultra-wide bandgap (UWBG) semiconductors allow for a smaller chip size, lower loss and higher frequency compared with their silicon (Si) counterparts, thus enabling a higher system efficiency and smaller form factor. Amongst the challenges for the development and deployment of WBG and UWBG devices is the efficient dissipation of heat, an unavoidable by-product of the higher power density. To mitigate the performance limitations and reliability issues caused by self-heating, thermal management is required at both device and package levels. Packaging in particular is a crucial milestone for the development of any power device technology; WBG and UWBG devices have both reached this milestone recently. This paper provides a timely review of the thermal management of WBG and UWBG power devices with an emphasis on packaged devices. Additionally, emerging UWBG devices hold good promise for high-temperature applications due to their low intrinsic carrier density and increased dopant ionization at elevated temperatures. The fulfillment of this promise in system applications, in conjunction with overcoming the thermal limitations of some UWBG materials, requires new thermal management and packaging technologies. To this end, we provide perspectives on the relevant challenges, potential solutions and research opportunities, highlighting the pressing needs for device–package electrothermal co-design and high-temperature packages that can withstand the high electric fields expected in UWBG devices. 

Power semiconductor devices, spanning blocking voltages from a few volts to tens of thousands of volts, are critical for efficient energy conversion in numerous applications and serve as key enablers of carbon neutrality. These devices can be realized in either vertical or lateral architectures, with the former preferred for high-power discrete devices and the latter offering high switching speeds and monolithic circuit integration. While lateral structures have long been utilized in low- and medium-voltage applications, recent advancements in multidimensional device architectures and (ultra-)wide-bandgap semiconductor materials have revitalized their potential for high-voltage applications. Multidimensional architectures, such as superjunction and multichannel designs, enable uniform electric field distribution for voltage scaling and, at the same time, boost carrier concentrations to enhance current capacity. The application of these architectures in gallium nitride and gallium oxide has led to the demonstration of multi-kilovolt lateral devices with diverse designs, achieving breakdown voltages exceeding 10 000 V, average electric fields up to 4.7 MV/cm, high-temperature operation up to 250 °C, and specific on-resistances at least 2–3 times lower than similarly rated vertical devices. Such advantages can be further enhanced through the implementation of monolithic bidirectional devices, a unique capability of the lateral architecture that enables the replacement of four vertical devices. This review provides an overview of multidimensional high-voltage lateral devices, emphasizing their fundamental device physics to inspire further applications across various material systems. The theoretical performance limits of multidimensional lateral devices are also analyzed. In addition, we discuss critical knowledge gaps that must be addressed for industrial adoption, highlighting emerging research opportunities in this rapidly evolving field. 

Power semiconductor devices are utilized as solid-state switches in power electronics systems, and their overarching design target is to minimize the conduction and switching losses. However, the unipolar figure-of-merit (FOM) commonly used for power device optimization does not directly capture the switching loss. In this Perspective paper, we explore three interdependent open questions for unipolar power devices based on a variety of wide bandgap (WBG) and ultra-wide bandgap (UWBG) materials: (1) What is the appropriate switching FOM for device benchmarking and optimization? (2) What is the optimal drift layer design for the total loss minimization? (3) How does the device power loss compare between WBG and UWBG materials? This paper starts from an overview of switching FOMs proposed in the literature. We then dive into the drift region optimization in 1D vertical devices based on a hard-switching FOM. The punch-through design is found to be optimal for minimizing the hard-switching FOM, with reduced doping concentration and thickness compared to the conventional designs optimized for static FOM. Moreover, we analyze the minimal power loss density for target voltage and frequency, which provides an essential reference for developing device- and package-level thermal management. Overall, this paper underscores the importance of considering switching performance early in power device optimization and emphasizes the inevitable higher density of power loss in WBG and UWBG devices despite their superior performance. Knowledge gaps and research opportunities in the relevant field are also discussed.