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   https://doi.org/10.1149/1945-7111/acc3c6  

   Huang, Q. (March 2023, Journal of The Electrochemical Society)

   Tin (Sn) films are electrodeposited on Au seed layers for the investigation of superconductivity. The effects of the presence of suppressing additives in electrolyte, the thickness of Sn films, and the room temperature aging of deposited Sn films on the superconducting transition behavior are systematically studied. In addition, the crystallographic structure of electrodeposited Sn and its evolution along with aging time are characterized and are discussed in conjunction with the superconductivity behavior. The current work represents an important step towards the processing of technologically viable superconducting devices. 

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2. Capillary transfer of soft films

   https://doi.org/10.1073/pnas.2000340117  

   Zhang, Yue; Yin, Mengtian; Baek, Yongmin; Lee, Kyusang; Zangari, Giovanni; Cai, Liheng; Xu, Baoxing (February 2020, Proceedings of the National Academy of Sciences)

   Existing transfer technologies in the construction of film-based electronics and devices are deeply established in the framework of native solid substrates. Here, we report a capillary approach that enables a fast, robust, and reliable transfer of soft films from liquid in a defect-free manner. This capillary transfer is underpinned by the transfer front of dynamic contact among receiver substrate, liquid, and film, and can be well controlled by a selectable motion direction of receiver substrates at a high speed. We demonstrate in extensive experiments, together with theoretical models and computational analysis, the robust capabilities of the capillary transfer using a versatile set of soft films with a broad material diversity of both film and liquid, surface-wetting properties, and complex geometric patterns of soft films onto various solid substrates in a deterministic manner. 

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3. Quasi-epitaxial growth of BaTiS3 films

   https://doi.org/10.1557/s43578-022-00776-y  

   Surendran, Mythili; Zhao, Boyang; Ren, Guodong; Singh, Shantanu; Avishai, Amir; Chen, Huandong; Han, Jae-Kyung; Kawasaki, Megumi; Mishra, Rohan; Ravichandran, Jayakanth (October 2022, Journal of Materials Research)
4. Resistance of two-dimensional superconducting films

   https://doi.org/10.1103/PhysRevB.104.L100507  

   König, E. J.; Protopopov, I. V.; Levchenko, A.; Gornyi, I. V.; Mirlin, A. D. (September 2021, Physical Review B)
5. Reliability of piezoelectric films for MEMS

   https://doi.org/10.35848/1347-4065/acf5f8  

   Trolier-McKinstry, Susan; Zhu, Wanlin; Akkopru-Akgun, Betul; He, Fan; Ko, Song Won; Fragkiadakis, Charalampos; Mardilovich, Peter (September 2023, Japanese Journal of Applied Physics)

   Abstract Thin films based on PbZr_1−xTi_xO₃and K_1−xNa_xNbO₃are increasingly being commercialized in piezoelectric MEMS due to the comparatively low drive voltages required relative to bulk actuators, as well as the facile approach to making sensor or actuator arrays. As these materials are incorporated into devices, it is critically important that they operate reliably over the lifetime of the system. This paper discusses some of the factors controlling the electrical and electromechanical reliability of lead zirconate titanate (PZT)-based piezoMEMS films. In particular, it will be shown the gradients in the Zr/Ti ratio through the depth of the films are useful in increasing the lifetime of the films under DC electrical stresses. 

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