Data Center hybrid air/liquid cooling systems such as rear door heat exchangers, overhead and in row cooling systems enable localized, on-demand cooling, or “smart cooling.” At the heart of all hybrid cooling systems is an air to liquid cross flow heat exchanger that regulates the amount of cooling delivered by the system by modulating the liquid or air flows and/or temperatures. Due the central role that the heat exchanger plays in the system response, understanding the transient response of the heat exchanger is crucial for the precise control of hybrid cooling system. This paper reports on the transient experimental characterizationmore »
Transient Thermal Performance of Rear Door Heat Exchanger in Local Contained Environment During Water Side Failure
The constant increase in data center computational and
processing requirements has led to increases in the IT
equipment power demand and cooling challenges of highdensity
(HD) data centers. As a solution to this, the hybrid and
liquid systems are widely used as part of HD data centers
thermal management solutions.
This study presents an experimental based investigation and
analysis of the transient thermal performance of a stand-alone
server cabinet. The total heat load of the cabinet is controllable
remotely and a rear door heat exchanger is attached with
controllable water flow rate. The cooling performances of two
different failure scenarios are investigated. One is in the water
chiller and another is in the water pump for the Rear Door Heat
eXchanger (RDHX). In addition, the study reports the impact
of each scenario on the IT equipment thermal response and on
the cabinet outlet temperature using a mobile temperature and
velocity mesh (MTVM) experimental tool. Furthermore, this
study also addresses and characterizes the heat exchanger
cooling performance during both scenarios.
- Award ID(s):
- 1738793
- Publication Date:
- NSF-PAR ID:
- 10057697
- Journal Name:
- ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems
- Page Range or eLocation-ID:
- V001T02A007
- Sponsoring Org:
- National Science Foundation
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