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Title: Characterization and computational modeling of electrical wires and wire bundles subject to bending loads
Authors:
; ; ; ; ; ; ; ;
Award ID(s):
1738723
Publication Date:
NSF-PAR ID:
10097074
Journal Name:
International Journal of Mechanical Sciences
Volume:
140
Issue:
C
Page Range or eLocation-ID:
211 to 227
ISSN:
0020-7403
Sponsoring Org:
National Science Foundation
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