An official website of the United States government
Abstract Gallium nitride high-electron-mobility transistors (GaN HEMTs) are at a point of rapid growth in defense (radar, SATCOM) and commercial (5G and beyond) industries. This growth also comes at a point at which the standard GaN heterostructures remain unoptimized for maximum performance. For this reason, we propose the shift to the aluminum nitride (AlN) platform. AlN allows for smarter, highly-scaled heterostructure design that will improve the output power and thermal management of III-nitride amplifiers. Beyond improvements over the incumbent amplifier technology, AlN will allow for a level of integration previously unachievable with GaN electronics. State-of-the-art high-current p-channel FETs, mature filter technology, and advanced waveguides, all monolithically integrated with an AlN/GaN/AlN HEMT, is made possible with AlN. It is on this new AlN platform that nitride electronics may maximize their full high-power, high-speed potential for mm-wave communication and high-power logic applications.
more »
« less
All‐Epitaxial Bulk Acoustic Wave Resonators
There is a growing interest in the exploration of the nitride material family for radically scaled, high frequency, ultrasonic devices by epitaxial growth techniques. Furthermore, the introduction of epitaxial growth techniques to conventional nitride‐based acoustic technology opens the door to exciting new families of structures for phonon confinement. As the need for higher frequency communications increases, both piezoelectrics and electrodes must scale to smaller dimensions. It has recently become possible to epitaxially grow single‐crystalline, wurtzite AlN/NbN piezoelectric/metal heterostructures. The epitaxial NbN films maintain high crystalline quality and electrical conductivity down to several nanometers thickness. This study demonstrates preliminary results on the feasibility of an all‐epitaxial bulk acoustic wave technology by growing and characterizing the radio frequency (RF) properties of an epitaxial AlN/NbN heterostructure.
more »
« less
- Award ID(s):
- 1741694
- PAR ID:
- 10138468
- Publisher / Repository:
- Wiley Blackwell (John Wiley & Sons)
- Date Published:
- Journal Name:
- physica status solidi (a)
- Volume:
- 217
- Issue:
- 7
- ISSN:
- 1862-6300
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
More Like this
-
-
AlN thin films are enabling significant progress in modern optoelectronics, power electronics, and microelectromechanical systems. The various AlN growth methods and conditions lead to different film microstructures. In this report, phonon scattering mechanisms that impact the cross-plane (κz; along the c-axis) and in-plane (κr; parallel to the c-plane) thermal conductivities of AlN thin films prepared by various synthesis techniques are investigated. In contrast to bulk single crystal AlN with an isotropic thermal conductivity of ∼330 W/m K, a strong anisotropy in the thermal conductivity is observed in the thin films. The κz shows a strong film thickness dependence due to phonon-boundary scattering. Electron microscopy reveals the presence of grain boundaries and dislocations that limit the κr. For instance, oriented films prepared by reactive sputtering possess lateral crystalline grain sizes ranging from 20 to 40 nm that significantly lower the κr to ∼30 W/m K. Simulation results suggest that the self-heating in AlN film bulk acoustic resonators can significantly impact the power handling capability of RF filters. A device employing an oriented film as the active piezoelectric layer shows an ∼2.5× higher device peak temperature as compared to a device based on an epitaxial film.more » « less
-
null (Ed.)Creating seamless heterostructures that exhibit the quantum Hall effect and superconductivity is highly desirable for future electronics based on topological quantum computing. However, the two topologically robust electronic phases are typically incompatible owing to conflicting magnetic field requirements. Combined advances in the epitaxial growth of a nitride superconductor with a high critical temperature and a subsequent nitride semiconductor heterostructure of metal polarity enable the observation of clean integer quantum Hall effect in the polarization-induced two-dimensional (2D) electron gas of the high-electron mobility transistor. Through individual magnetotransport measurements of the spatially separated GaN 2D electron gas and superconducting NbN layers, we find a small window of magnetic fields and temperatures in which the epitaxial layers retain their respective quantum Hall and superconducting properties. Its analysis indicates that in epitaxial nitride superconductor/semiconductor heterostructures, this window can be significantly expanded, creating an industrially viable platform for robust quantum devices that exploit topologically protected transport.more » « less
-
The recent demonstration of W mm−1output power at 94 GHz in AlN/GaN/AlN high‐electron‐mobility transistors (HEMTs) has established AlN as a promising platform for millimeter‐wave electronics. The current state‐of‐art AlN HEMTs using ex situ‐deposited silicon nitride (SiN) passivation layers suffer from soft gain compression due to trapping of carriers by surface states. Reducing surface state dispersion in these devices is thus desired to access higher output powers. Herein, a potential solution using a novel in situ crystalline AlN passivation layer is provided. A thick, 30+ nm‐top AlN passivation layer moves the as‐grown surface away from the 2D electron gas (2DEG) channel and reduces its effect on the device. Through a series of metal‐polar AlN/GaN/AlN heterostructure growths, it is found that pseudomorphically strained 15 nm thin GaN channels are crucial to be able to grow thick AlN barriers without cracking. The fabricated recessed‐gate HEMTs on an optimized heterostructure with 50 nm AlN barrier layer and 15 nm GaN channel layer show reduction in dispersion down to compared with in current state‐of‐art ex situ SiN‐passivated HEMTs. These results demonstrate the efficacy of this unique in situ crystalline AlN passivation technique and should unlock higher mm‐wave powers in next‐generation AlN HEMTs.more » « less
-
Abstract Single‐crystalline inorganic semiconductor nanomembranes (NMs) have attracted great attention over the last decade, which poses great advantages to complex device integration. Applications in heterogeneous electronics and flexible electronics have been demonstrated with various semiconductor nanomembranes. Single‐crystalline aluminum nitride (AlN), as an ultrawide‐bandgap semiconductor with great potential in applications such as high‐power electronics has not been demonstrated in its NM forms. This very first report demonstrates the creation, transfer‐printing, and characteristics of the high‐quality single‐crystalline AlN NMs. This work successfully transfers the AlN NMs onto various foreign substrates. The crystalline quality of the NMs has been characterized by a broad range of techniques before and after the transfer‐printing and no degradation in crystal quality has been observed. Interestingly, a partial relaxation of the tensile stress has been observed when comparing the original as‐grown AlN epi and the transferred AlN NMs. In addition, the transferred AlN NMs exhibits the presence of piezoelectricity at the nanoscale, as confirmed by piezoelectric force microscopy. This work also comments on the advantages and the challenges of the approach. Potentially, the novel approach opens a viable path for the development of the AlN‐based heterogeneous integration and future novel electronics and optoelectronics.more » « less
