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Title: High Tunnelling Magnetoresistance in Magnetic Tunnel Junctions with Sub-nm thick Al2O3 Tunnel Barriers Fabricated Using Atomic Layer Deposition
Pinhole-free and defect-free ultrathin dielectric tunnel barriers (TBs) is a key to obtaining high tunnelling magnetoresistance (TMR) and efficient switching in magnetic tunnel junctions (MTJs). Among others, atomic layer deposition (ALD) provides a unique approach for the fabrication of ultrathin TBs with several advantages including an atomic-scale control on the TB thickness, conformal coating, and low defects density. Motivated by this, this work explores fabrication and characterization of spin-valve Fe/ALD-Al2O3/Fe MTJs with ALD-Al2O3 TB thickness of 0.55 nm using in situ ALD. Remarkably, high TMR values of ~77% and ~ 90% have been obtained respectively at room temperature and at 100 K, which are comparable to the best reported values on MTJs having thermal AlOx TBs with optimized device structures. In situ scanning tunnelling spectroscopy characterization of the ALD-Al2O3 TBs has revealed a higher tunnel barrier height (Eb) of 1.33±0.06 eV, in contrast to Eb~0.3-0.6 eV for their AlOx TB counterparts, indicative of significantly lower defect concentration in the former. This first success of the MTJs with sub-nm thick ALD-Al2O3 TBs demonstrates the feasibility of in situ ALD for fabrication of pinhole-free and low-defect ultrathin TBs for practical applications and the performance could be further improved through device optimization.  more » « less
Award ID(s):
1809293 1909292 1508494
NSF-PAR ID:
10175930
Author(s) / Creator(s):
; ;
Date Published:
Journal Name:
ACS Applied Materials & Interfaces
ISSN:
1944-8244
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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