Chiplet integration using 2.5D packaging is gaining popularity nowadays which enables several interesting features like heterogeneous integration and drop-in design method. In the traditional die-by-die approach of designing a 2.5D system, each chiplet is designed independently without any knowledge of the package RDLs. In this paper, we propose a Chip-Package Co-Design flow for implementing 2.5D systems using existing commercial chip design tools. Our flow encompasses 2.5D-aware partitioning suitable for SoC design, Chip-Package Floorplanning, and post-design analysis and verification of the entire 2.5D system. We also designed our own package planners to route RDL layers on top of chiplet layers. We use an ARM Cortex-M0 SoC system to illustrate our flow and compare analysis results with a monolithic 2D implementation of the same system. We also compare two different 2.5D implementations of the same SoC system following the drop-in approach. Alongside the traditional die-by-die approach, our holistic flow enables design efficiency and flexibility with accurate cross-boundary parasitic extraction and design verification.
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TAP-2.5D: A Thermally-Aware Chiplet Placement Methodology for 2.5D Systems
Heterogeneous systems are commonly used today to
sustain the historic benefits we have achieved through technology
scaling. 2.5D integration technology provides a cost-effective
solution for designing heterogeneous systems. The traditional
physical design of a 2.5D heterogeneous system closely packs the
chiplets to minimize wirelength, but this leads to a thermally-inefficient
design. We propose TAP-2.5D: the first open-source
network routing and thermally-aware chiplet placement methodology
for heterogeneous 2.5D systems. TAP-2.5D strategically inserts
spacing between chiplets to jointly minimize the temperature and
total wirelength, and in turn, increases the thermal design power
envelope of the overall system. We present three case studies
demonstrating the usage and efficacy of TAP-2.5D.
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- Award ID(s):
- 1716352
- NSF-PAR ID:
- 10248937
- Date Published:
- Journal Name:
- Design, Automation and Test in Europe (DATE)
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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- Free Publicly Accessible Full Text
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Accepted Manuscript1.0
- Conference Paper:
- The DOI is not currently available.
