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1. Heterogeneously integrated VCSELs on silicon

   https://doi.org/10.1117/12.2608839  

   Espenhahn, Leah ; Carlson, John ; Su, Patrick ; Dallesasse, John M. ( March 2022 , Proceedings Volume 12020, Vertical-Cavity Surface-Emitting Lasers XXVI)

   Choquette, Kent D. ; Lei, Chun ; Graham, Luke A. (Ed.)

   A wafer-scale CMOS-compatible process for heterogeneous integration of III-V epitaxial material onto silicon for photonic device fabrication is presented. Transfer of AlGaAs-GaAs Vertical-Cavity Surface-Emitting Laser (VCSEL) epitaxial material onto silicon using a carrier wafer process and metallic bonding is used to form III-V islands which are subsequently processed into VCSELs. The transfer process begins with the bonding of III-V wafer pieces epitaxy-down on a carrier wafer using a temporary bonding material. Following substrate removal, precisely-located islands of material are formed using photolithography and dry etching. These islands are bonded onto a silicon host wafer using a thin-film non-gold metal bonding process and the transfer wafer is removed. Following the bonding of the epitaxial islands onto the silicon wafer, standard processing methods are used to form VCSELs with non-gold contacts. The removal of the GaAs substrate prior to bonding provides an improved thermal pathway which leads to a reduction in wavelength shift with output power under continuous-wave (CW) excitation. Unlike prior work in which fullyfabricated VCSELs are flip-chip bonded to silicon, all photonic device processing takes place after the epitaxial transfer process. The electrical and optical performance of heterogeneously integrated 850nm GaAs VCSELs on silicon is compared to their as-grown counterparts. The demonstrated method creates the potential for the integration of III-V photonic devices with silicon CMOS, including CMOS imaging arrays. Such devices could have use in applications ranging from 3D imaging to LiDAR. 

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2. Multi-chip heterogeneously integrated array of active three-terminal transistor lasers and passive photonic structures for electronic-photonic integration on silicon

   https://doi.org/10.1117/12.2544009  

   Carlson, John A. ; Dallesasse, John M. ( February 2020 , Proceedings Volume 11285, Silicon Photonics XV)

   Reed, Graham T. ; Knights, Andrew P. (Ed.)

   An array of active photonic devices is fabricated in unison after a heterogeneous integration process first metal-eutectically bonds these distinct materials as a distribution onto a silicon host wafer. The patterning out of heterogeneous materials followed by the formation of all photonic devices allows for wide-area fine-alignment without the need for discrete die alignment or placement. The integration process is designed as a CMOS-compatible, scalable method for bringing together distinct III-V epitaxial structures and optical-waveguiding epitaxial structures, demonstrating the capabilities of forming a multi-chip layer of photonic materials. Integrated GaAs-based vertical light-emitting transistors (LET) are designed and fabricated as the active devices whose third electrical terminal provides an electrical interconnect and thermal dissipation path to the silicon host wafer. The performance of these devices as both electrical transistors and spontaneous-emission optical devices is compared to their monolithically-integrated counterparts to investigate improvements in device characteristics when integrated onto silicon. The fabrication methods are modified and optimized for thin-film transferred materials and are then extended to transistor laser (TL) fabrication. Passive waveguiding structures are designed and simulated for coupling light from the active devices, and their fabrication scheme is presented such that it can be similarly performed with transferred materials. Work toward the demonstration of integrated transistor lasers is shown to represent progress toward an electronic-photonic circuit network. The combination of heterogeneous integration with three-terminal photonic structures enables an elegant solution to both packaging and signal interconnect constraints for the implementation of photonic logic in silicon photonics systems. 

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3. Nonvolatile Electrically Reconfigurable Integrated Photonic Switch Enabled by a Silicon PIN Diode Heater

   https://doi.org/10.1002/adma.202001218  

   Zheng, Jiajiu ; Fang, Zhuoran ; Wu, Changming ; Zhu, Shifeng ; Xu, Peipeng ; Doylend, Jonathan K. ; Deshmukh, Sanchit ; Pop, Eric ; Dunham, Scott ; Li, Mo ; et al ( June 2020 , Advanced Materials)

   Reconfigurability of photonic integrated circuits (PICs) has become increasingly important due to the growing demands for electronic–photonic systems on a chip driven by emerging applications, including neuromorphic computing, quantum information, and microwave photonics. Success in these fields usually requires highly scalable photonic switching units as essential building blocks. Current photonic switches, however, mainly rely on materials with weak, volatile thermo‐optic or electro‐optic modulation effects, resulting in large footprints and high energy consumption. As a promising alternative, chalcogenide phase‐change materials (PCMs) exhibit strong optical modulation in a static, self‐holding fashion, but the scalability of present PCM‐integrated photonic applications is still limited by the poor optical or electrical actuation approaches. Here, with phase transitions actuated by in situ silicon PIN diode heaters, scalable nonvolatile electrically reconfigurable photonic switches using PCM‐clad silicon waveguides and microring resonators are demonstrated. As a result, intrinsically compact and energy‐efficient switching units operated with low driving voltages, near‐zero additional loss, and reversible switching with high endurance are obtained in a complementary metal‐oxide‐semiconductor (CMOS)‐compatible process. This work can potentially enable very large‐scale CMOS‐integrated programmable electronic–photonic systems such as optical neural networks and general‐purpose integrated photonic processors.

    

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4. Miniature, highly sensitive MOSCAP ring modulators in co-optimized electronic-photonic CMOS

   https://doi.org/10.1364/PRJ.438047  

   Gevorgyan, Hayk ; Khilo, Anatol ; Wade, Mark T. ; Stojanović, Vladimir M. ; Popović, Miloš A. ( January 2022 , Photonics Research)

   Convergence of high-performance silicon photonics and electronics, monolithically integrated in state-of-the-art CMOS platforms, is the holy grail for enabling the ultimate efficiencies, performance, and scaling of electronic-photonic systems-on-chip. It requires the emergence of platforms that combine state-of-the-art RF transistors with optimized silicon photonics, and a generation of photonic device technology with ultralow energies, increased operating spectrum, and the elimination of power-hungry thermal tuning. In this paper, in a co-optimized monolithic electronics-photonics platform (GlobalFoundries 45CLO), we turn the metal-oxide-semiconductor (MOS) field-effect transistor’s basic structure into a novel, highly efficient MOS capacitor ring modulator. It has the smallest ring cavity (1.5 μm radius), largest corresponding spur-free free spectral range ( FSR = 8.5    THz ), and record 30 GHz/V shift efficiency in the O-band among silicon modulators demonstrated to date. With 1 V pp RF drive, we show an open optical eye while electro-optically tuning the modulator to track over 400 pm (69 GHz) change in the laser wavelength (using 2.5 V DC range). A 90 GHz maximum electro-optic resonance shift is demonstrated with under 40 nW of power, providing a strong nonthermal tuning mechanism in a CMOS photonics platform. The modulator has a separately optimized body layer but shares the gate device layer and the gate oxide with 45 nm transistors, while meeting all CMOS manufacturability design rules. This type of convergent evolution of electronics and photonics may be the future of platforms for high-performance systems-on-chip. 

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5. Microwave signal switching on a silicon photonic chip

   https://doi.org/10.1038/s41598-019-47683-7  

   Fang, Cheng-Yi ; Lin, Hung-Hsi ; Alouini, Mehdi ; Fainman, Yeshaiahu ; El Amili, Abdelkrim ( August 2019 , Scientific Reports)

   Microwave photonics uses light to carry and process microwave signals over a photonic link. However, light can instead be used as a stimulus to microwave devices that directly control microwave signals. Such optically controlled amplitude and phase-shift switches are investigated for use in reconfigurable microwave systems, but they suffer from large footprint, high optical power level required for switching, lack of scalability and complex integration requirements, restricting their implementation in practical microwave systems. Here, we report Monolithic Optically Reconfigurable Integrated Microwave Switches (MORIMSs) built on a CMOS compatible silicon photonic chip that addresses all of the stringent requirements. Our scalable micrometer-scale switches provide higher switching efficiency and require optical power orders of magnitude lower than the state-of-the-art. Also, it opens a new research direction on silicon photonic platforms integrating microwave circuitry. This work has important implications in reconfigurable microwave and millimeter wave devices for future communication networks.

    

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