Air‐stable p‐type SnF2:Cs2SnI6with a bandgap of 1.6 eV has been demonstrated as a promising material for Pb‐free halide perovskite solar cells. Crystalline Cs2SnI6phase is obtained with CsI, SnI2, and SnF2salts in gamma‐butyrolactone solvent, but not with dimethyl sulfoxide and
- Award ID(s):
- 2016552
- NSF-PAR ID:
- 10281907
- Date Published:
- Journal Name:
- Journal of Materials Chemistry A
- Volume:
- 8
- Issue:
- 32
- ISSN:
- 2050-7488
- Page Range / eLocation ID:
- 16599 to 16608
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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N,N ‐dimethylformamide solvents. Cs2SnI6is found to be stable for at least 1000 h at 100 °C when dark annealed in nitrogen atmosphere. In this study, Cs2SnI6has been used in a superstrate n–i–p planar device structure enabled by a spin‐coated absorber thickness of ≈2 μm on a chemical bath deposited Zn(O,S) electron transport layer. The best device power conversion efficiency reported here is 5.18% withV OCof 0.81 V, 9.28 mA cm−2J SC, and 68% fill factor. The dark saturation current and diode ideality factor are estimated as 1.5 × 10−3 mA cm−2and 2.18, respectively. The devices exhibit a highV OCdeficit and low short‐circuit current density due to high bulk and interface recombination. Device efficiency can be expected to increase with improvement in material and interface quality, charge transport, and device engineering. -
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Abstract Surface recombination is a major bottleneck for realizing highly efficient micro/nanostructure solar cells. Here, parametric studies of the influence of Si microwire (SiMW) surface‐facet orientation (rectangular with flat‐facets, {110}, {100} and circular), with a fixed height of 10 µm, diameter (
D = 1.5–9.5 µm), and sidewall spacing (S = 2.5–8.5 µm), and mesh‐grid density (1–16 mm−2) on recombination and carrier collection in SiMW solar cells with radial p‐n junctions are reported. An effective surface passivation layer composed of thin thermally grown silicon dioxide (SiO2) and silicon nitride (SiNx ) layers is employed. For a fixedD of 1.5 µm, tight SiMW spacing results in improved short‐circuit current density (J sc= 30.1 mA cm−2) and sparse arrays result in open‐circuit voltages (V oc= 0.552 V) that are similar to those of control Si planar cells. For a fixedS , smallerD results in better light trapping at shorter wavelengths and higherJ scwhile largerD exhibits better light trapping at larger wavelengths and a higherV oc. With a mesh‐grid electrode the power conversion efficiency increases to 15.3%. These results provide insights on the recombination mechanisms in SiMW solar cells and provide general design principles for optimizing their performance. -
Resonant tunneling diodes (RTDs) have come full-circle in the past 10 years after their demonstration in the early 1990s as the fastest room-temperature semiconductor oscillator, displaying experimental results up to 712 GHz and fmax values exceeding 1.0 THz [1]. Now the RTD is once again the preeminent electronic oscillator above 1.0 THz and is being implemented as a coherent source [2] and a self-oscillating mixer [3], amongst other applications. This paper concerns RTD electroluminescence – an effect that has been studied very little in the past 30+ years of RTD development, and not at room temperature. We present experiments and modeling of an n-type In0.53Ga0.47As/AlAs double-barrier RTD operating as a cross-gap light emitter at ~300K. The MBE-growth stack is shown in Fig. 1(a). A 15-μm-diam-mesa device was defined by standard planar processing including a top annular ohmic contact with a 5-μm-diam pinhole in the center to couple out enough of the internal emission for accurate free-space power measurements [4]. The emission spectra have the behavior displayed in Fig. 1(b), parameterized by bias voltage (VB). The long wavelength emission edge is at = 1684 nm - close to the In0.53Ga0.47As bandgap energy of Ug ≈ 0.75 eV at 300 K. The spectral peaks for VB = 2.8 and 3.0 V both occur around = 1550 nm (h = 0.75 eV), so blue-shifted relative to the peak of the “ideal”, bulk InGaAs emission spectrum shown in Fig. 1(b) [5]. These results are consistent with the model displayed in Fig. 1(c), whereby the broad emission peak is attributed to the radiative recombination between electrons accumulated on the emitter side, and holes generated on the emitter side by interband tunneling with current density Jinter. The blue-shifted main peak is attributed to the quantum-size effect on the emitter side, which creates a radiative recombination rate RN,2 comparable to the band-edge cross-gap rate RN,1. Further support for this model is provided by the shorter wavelength and weaker emission peak shown in Fig. 1(b) around = 1148 nm. Our quantum mechanical calculations attribute this to radiative recombination RR,3 in the RTD quantum well between the electron ground-state level E1,e, and the hole level E1,h. To further test the model and estimate quantum efficiencies, we conducted optical power measurements using a large-area Ge photodiode located ≈3 mm away from the RTD pinhole, and having spectral response between 800 and 1800 nm with a peak responsivity of ≈0.85 A/W at =1550 nm. Simultaneous I-V and L-V plots were obtained and are plotted in Fig. 2(a) with positive bias on the top contact (emitter on the bottom). The I-V curve displays a pronounced NDR region having a current peak-to-valley current ratio of 10.7 (typical for In0.53Ga0.47As RTDs). The external quantum efficiency (EQE) was calculated from EQE = e∙IP/(∙IE∙h) where IP is the photodiode dc current and IE the RTD current. The plot of EQE is shown in Fig. 2(b) where we see a very rapid rise with VB, but a maximum value (at VB= 3.0 V) of only ≈2×10-5. To extract the internal quantum efficiency (IQE), we use the expression EQE= c ∙i ∙r ≡ c∙IQE where ci, and r are the optical-coupling, electrical-injection, and radiative recombination efficiencies, respectively [6]. Our separate optical calculations yield c≈3.4×10-4 (limited primarily by the small pinhole) from which we obtain the curve of IQE plotted in Fig. 2(b) (right-hand scale). The maximum value of IQE (again at VB = 3.0 V) is 6.0%. From the implicit definition of IQE in terms of i and r given above, and the fact that the recombination efficiency in In0.53Ga0.47As is likely limited by Auger scattering, this result for IQE suggests that i might be significantly high. To estimate i, we have used the experimental total current of Fig. 2(a), the Kane two-band model of interband tunneling [7] computed in conjunction with a solution to Poisson’s equation across the entire structure, and a rate-equation model of Auger recombination on the emitter side [6] assuming a free-electron density of 2×1018 cm3. We focus on the high-bias regime above VB = 2.5 V of Fig. 2(a) where most of the interband tunneling should occur in the depletion region on the collector side [Jinter,2 in Fig. 1(c)]. And because of the high-quality of the InGaAs/AlAs heterostructure (very few traps or deep levels), most of the holes should reach the emitter side by some combination of drift, diffusion, and tunneling through the valence-band double barriers (Type-I offset) between InGaAs and AlAs. The computed interband current density Jinter is shown in Fig. 3(a) along with the total current density Jtot. At the maximum Jinter (at VB=3.0 V) of 7.4×102 A/cm2, we get i = Jinter/Jtot = 0.18, which is surprisingly high considering there is no p-type doping in the device. When combined with the Auger-limited r of 0.41 and c ≈ 3.4×10-4, we find a model value of IQE = 7.4% in good agreement with experiment. This leads to the model values for EQE plotted in Fig. 2(b) - also in good agreement with experiment. Finally, we address the high Jinter and consider a possible universal nature of the light-emission mechanism. Fig. 3(b) shows the tunneling probability T according to the Kane two-band model in the three materials, In0.53Ga0.47As, GaAs, and GaN, following our observation of a similar electroluminescence mechanism in GaN/AlN RTDs (due to strong polarization field of wurtzite structures) [8]. The expression is Tinter = (2/9)∙exp[(-2 ∙Ug 2 ∙me)/(2h∙P∙E)], where Ug is the bandgap energy, P is the valence-to-conduction-band momentum matrix element, and E is the electric field. Values for the highest calculated internal E fields for the InGaAs and GaN are also shown, indicating that Tinter in those structures approaches values of ~10-5. As shown, a GaAs RTD would require an internal field of ~6×105 V/cm, which is rarely realized in standard GaAs RTDs, perhaps explaining why there have been few if any reports of room-temperature electroluminescence in the GaAs devices. [1] E.R. Brown,et al., Appl. Phys. Lett., vol. 58, 2291, 1991. [5] S. Sze, Physics of Semiconductor Devices, 2nd Ed. 12.2.1 (Wiley, 1981). [2] M. Feiginov et al., Appl. Phys. Lett., 99, 233506, 2011. [6] L. Coldren, Diode Lasers and Photonic Integrated Circuits, (Wiley, 1995). [3] Y. Nishida et al., Nature Sci. Reports, 9, 18125, 2019. [7] E.O. Kane, J. of Appl. Phy 32, 83 (1961). [4] P. Fakhimi, et al., 2019 DRC Conference Digest. [8] T. Growden, et al., Nature Light: Science & Applications 7, 17150 (2018). [5] S. Sze, Physics of Semiconductor Devices, 2nd Ed. 12.2.1 (Wiley, 1981). [6] L. Coldren, Diode Lasers and Photonic Integrated Circuits, (Wiley, 1995). [7] E.O. Kane, J. of Appl. Phy 32, 83 (1961). [8] T. Growden, et al., Nature Light: Science & Applications 7, 17150 (2018).more » « less
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Herein, low‐cost p‐type upgraded metallurgical‐grade (UMG) multicrystalline silicon wafers are processed from the edge of the silicon cast using a multi‐stage defect‐engineering approach, incorporating gettering and hydrogenation to improve the wafer quality. Significant reductions in the concentration of interstitial iron and improvements in the bulk lifetime from 15 to 130 µs are observed. Subsequently, all the surface layers are removed and silicon heterojunction solar cells are fabricated. The cells exhibit an efficiency of 18.7%, and open‐circuit voltages over 690 mV is formed using wafers with initial lifetimes of <15 µs. This demonstration of such high voltages, the highest recorded for this material to date, indicates the power of the gettering and hydrogenation processes used and the potential of p‐type UMG silicon to fabricate heterojunction solar cells and other solar cell technologies capable of high open‐circuit voltages.
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Development of high‐performance wide‐bandgap perovskites is a key component to enable tandem solar cells with either a silicon or low‐bandgap perovskites. However, the presence of defects in the Br‐rich wide‐bandgap perovskites, especially in the grain boundaries (GBs) has been particularly challenging and limits its performance. Herein, to accomplish the passivation of these defects, a combination of cation management with rubidium (Rb) introduction into the triple cation combination of cesium/formamidinium/methylammonium (CsFAMA) is exercised. Passivation is further enhanced by secondary growth (SG) using guanidinium iodide. In‐depth assessments of GB defect passivation are performed using Kelvin probe force microscopy (KPFM) and nanoscale charge‐carrier dynamics mappings provide insightful details on the presence of GBs defects and their suppression by the cation management and SG techniques. Reduction of unreacted PbX2to realize a highly crystalline perovskite surface is achieved after incorporating Rb and SG treatment. As a result, a champion cell for 1.78 eV (FA0.79MA0.16Cs0.05)0.95Rb0.05Pb(I0.6Br0.4)3wide‐bandgap perovskite with an efficiency of 17.71% along with enhancement in all photovoltaic parameters is achieved. This study introduces a new way to analyze GB defects and reveals the consequence of defect passivation on charge‐carrier dynamics for realizing efficient perovskites.
- Free Publicly Accessible Full Text
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Accepted Manuscript1.0
- Journal Article:
- https://doi.org/10.1039/d0ta04575f
